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Electroless Plating

No change in size, 14:00, 14 May 2014
7.1.2.2 Immersion Processes
====7.1.2.2 Immersion Processes====
The immersion processes are usually applied in the plating of the metals gold, silver, and tin. If the material to be coated is less precious, i.e. exhibits a negative standard potential against the metal ions in the surrounding solution, it goes into solution releasing electrons while the more precious metal ions are reduced by absorbing electrons and being deposited on the electrode. This process can continue until the complete surface of the substrate is covered with a thin layer of the more precious metal. This limits the maximum achievable layer thickness to approx. 0.1 μm <xr id="tab:Immersion Gold ElectrolytesImmersion_Gold_Electrolytes"/> (Table 7.5).
<figtable id="tab:Immersion Gold ElectrolytesImmersion_Gold_Electrolytes">
<caption>'''Table 7.5: Immersion Gold Electrolytes'''</caption>

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