Data Book of Electrical Contacts

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Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
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Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle this process consists of pressure welding with the aid of ultrasound. The metallurgical bond is mainly caused by frictional heat created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and un...

Featured Files

Strain hardening of oxidized AgSnO2 88 12 PW4.jpg
Strain hardening of oxidized Ag/SnO2 88/12 PW4 by cold working
Pages: Werkstoffe auf Silber-Basis,
Silver Based Materials

by Doduco Redaktion

Porosity of an electroplated hard gold layer.jpg
Porosity of an electroplated hard gold layer as a function of the layer thickness at different surface roughness values Ra
Pages: Testing of Contact Surface Layers,
Prüfung von Kontaktschichten

by Doduco Redaktion