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→Layer Thickness
The primary requirement on an electroplated deposit is its thickness, since a series of other properties such as porosity, hardness and ductility, are depending on the layer thickness. A widely used method for thickness measurement is the microscopical evaluation of a mounted micro
section. Because of optical resolution limits however, layer thicknesses below 0.5 μm cannot be measured with sufficient accuracy. For low coating
thicknesses the x-ray fluorescence method is used, which often is integrated for quality assurance into the manufacturing process, for example in selective reeltoreel-to- reel electroplating plating lines. In this process, the returned characteristic x-ray impulses of the coating material and the substrate, generated by the primary x-rays, are detected and counted and then converted into material thickness by a computerized indicator or recording and control unit.
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