Changes

During ''hot bonding'' the required heat energy is applied by a short term electrical current pulse (<xr id="fig:Hot_bonding_of_bimetal_rivets"/><!--(Fig. 3.2)-->).

<figure id="fig:Hot_bonding_of_bimetal_rivets">

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In the case of Ag and Cu a molten eutectic alloy of silver and copper is formed in the constriction area between the two wire ends. When using metal oxide containing contact materials, the non-soluble oxide particles tend to coagulate and the bonding strength between the component materials is greatly reduced. Therefore the cold bonding technology is preferred for these contact materials. During cold bonding, the required high surface deformation ratio can be reduced for the hot bonding process which allows the head to shank diameter ratio to be reduced below 2:1.

*Typical contact shapes for composite rivets (<xr id="fig:Typical_contact_shapes_for_composite_rivets"/>)

<figure id="fig:Typical_contact_shapes_for_composite_rivets">

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*Contact materials <br /> Ag, AgNi 0,15 (ARGODUR), AgCu, AgCuNi (ARGODUR 27), Ag/Ni (SINIDUR), Ag/CdO (DODURIT CDO), Ag/SnO₂ (SISTADOX), Ag/ZnO (DODURIT ZNO)<br />

*Dimensional ranges (<xr id="fig:Dimensional_ranges"/>) <br />These parameters cannot be chosen independently of each other. They depend mainly on the mechanical properties of the contact material. Before specifying the final dimensions we recommend to consult with the contact manufacturer. <br />

<figure id="fig:Dimensional_ranges">

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*Quality criteria and tolerances <xr id="fig:Quality_criteria_and_tolerances"/>

<figure id="fig:Quality_criteria_and_tolerances">

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