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Electroless Plating

1 byte added, 14:32, 3 January 2023
Immersion Deposition of Tin
====<!--7.1.2.5-->Immersion Deposition of Tin====
A tin coating by ion exchange is usually not possible, since copper is the more precious metal. By adding thio-urea the electro-chemical potential of copper is reduced to a level (approx. 450 mV, significantly lower than tin) that allows the exchange reaction. Using a suitable electrolyte composition and enhancer solutions like within the DODUSTAN process (<xr id="fig:Process flow for electroless tin deposition using the DODUSTAN process"/><!--(Fig. 7.4)-->) . The tin coatings produced in that way, even under usually unfavorable conditions of copper concentrations of 7 g/l in the electrolyte, are well solderable.
<figure id="fig:Process flow for electroless tin deposition using the DODUSTAN process">

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