Changes

As an alternative for gold wire bonding applications, a thicker gold layer of 0.2 – 0.5 μm can be applied using an electroless process. Typical electrolytes work at a temperature of approx. 80°C with deposition rates of 0.3 – 0.4 μm per 30 minutes. There are however limitations with these electroless electrolytes concerning their stability and the robustness of the process, compared to other electroplating processes which reduces their wider usage (<xr id="fig:Coating composition of a printed circuit board"/><!--(Fig. 7.3)-->).