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Applications for Bonding Technologies

17 bytes added, 16:13, 14 December 2022
Electroless Metal Deposition on Printed Circuit Boards
== Electroless Metal Deposition on Printed Circuit Boards==
Printed circuit boards are also used as circuit carriers. Since many of the conductive structures on the PCB are not electrically connected, the final surface coatings are produced using an electroless process (<xr id="fig:Electroless deposition on a printed circuit board"/><!--Fig. 9.2:-->). (Chapter [[Electroless_Plating|Electroless Plating]]). Besides bonding to Nickel/Gold surfaces, soldering is the most widely used process to create conductive connections. This can also be performed on electroless deposited tin surface coatings.
<figure id="fig:Electroless deposition on a printed circuit board">

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