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→Silver-Metal Oxide Materials Ag/CdO, Ag/SnO2, Ag/ZnO
Manufacturing of Ag/SnO<sub>2</sub> by ''internal oxidation'' is possible in principle, but during heat treatment of alloys containing > 5 wt% of tin in oxygen, dense oxide layers formed on the surface of the material prohibit the further diffusion of oxygen into the bulk of the material. By adding Indium or Bismuth to the alloy, the internal oxidation is possible and results in materials that typically are rather hard and brittle and may show somewhat elevated contact resistance and is limited to applications in relays. Adding a brazable fine silver layer to such materials results in a semifinished material, suitable for the manufacture as smaller weld profiles (<xr id="fig:Micro structure of Ag SnO2 92 8 WTOS F"/>)<!--(Fig. 2.116)-->. Because of their resistance to material transfer and low arc erosion, these materials find for example a broader application in automotive relays (<xr id="tab:Application Examples of Silver–Metal Oxide Materials"/>)<!--(Table 2.31)-->.
''Powder metallurgy'' plays a significant role in the manufacturing of Ag/SnO<sub>2</sub> contact materials. Besides SnO<sub>2</sub> a smaller amount (<1 wt%) of one or more other metal oxides such as WO<sub>3</sub>, MoO<sub>3</sub>, CuO and/or Bi<sub>2</sub>O<sub>3</sub> are added. These
additives improve the wettability of the oxide particles and increase the viscosity of the Ag melt. They also provide additional benefits to the mechanical and arcing contact properties of materials in this group (<xr id="tab:Physical Mechanical Properties as Manufacturing"/>). (Download Table 2.26 as PDF: [[File:Physical Mechanical properties.pdf|Physical and Mechanical Properties as well as Manufacturing Processes andForms of Supply of Extruded Silver-Tin Oxide (SISTADOX) Contact Materials]])''
In the manufacture for the initial powder mixes, different processes are applied which provide specific advantages of the resulting materials in respect to their contact properties <!--[[#figures|(Figs. 43 – 75)]]-->. Some of them are described here as follows:
