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→13.4.2.2 Temperature Rise
Testing for temperature rise is required only for switching devices in the new stage. During use however over the entire life of the device no damages due to temperature rise are allowed in the device or at ist terminal points.
<figure id="fig:Maximum movable bridge temperature rise for different contact materials">Fig[[File:Maximum movable bridge temperature rise for different contact materials.13.13:jpg|right|thumb|Maximum movable bridgetemperature rise for different contactmaterials in a 132 kW contactor afterhigh load (AC-4) switching1 Ag/CdO 88/12 sintered
and extruded
2 Ag/SnO2 7SnO27.5In2O3 25In2O32.5
internally oxidized
3 Ag/SnO2 88/12
sintered and extruded
4 Ag/SnO2 11.5 WO3 0.5sintered and extruded5 Ag/SnO SnO2 11.6 MO MO4 0.4sintered and extruded]]</figure>For the assessment of contact materials a temperature rise test is frequently performed after a specified number of switching operations accompanied by arcing <xr id="fig:Maximum movable bridge temperature rise for different contact materials"/> (Fig. 13.13). The most important characteristic is the measured temeperature rise of the movable bridge contacts. If a certain upper limit of temperature is reached, adjacent plastic components may be irreversibly damaged.
====13.4.2.3 Analysis of the Switching Sequence====
