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→7.1.2.4 Electroless Deposition of Nickel/Gold
====7.1.2.4 Electroless Deposition of Nickel/Gold====
Electroless deposited nickel coatings with an additional immersion layer of gold are seeing increased importance in the coating of printed circuit boards (PCBs). The process sequence is shown in <xr id="tabfig:Electroless Deposition of Nickel Gold"/> (Fig. 7.2) using the example of the DODUCHEM process.
<figure id="fig:Electroless Deposition of Nickel Gold">
[[File:Electroless Deposition of Nickel Gold.jpg|right|thumb|Electroless Deposition of Nickel/Gold]]
