Main Articel: [[Precious Metal Electrolytes| Precious Metal Electrolytes]]
*'''Gold electrolytes''' For functional and decorative purposes pure gold, hard gold, low-karat gold, or colored gold coatings are deposited. Depending on the requirements, acidic, neutral, or cyanide electrolytes based on potassium gold cyanide or cyanide free and neutral electrolytes based on gold sulfite complexes are used.
*'''Palladium and Platinum electrolytes''' Palladium is mostly deposited as a pure metal, for applications in electrical contacts however also as palladium nickel. For higher value jewelry allergy protective palladium intermediate layers are used as a diffusion barrier over copper alloy substrate materials. Platinum is mostly used as a surface layer on jewelry items.
*'''Ruthenium electrolytes''' Ruthenium coatings are mostly used for decorative purposes creating a fashionable “grey” ruthenium color on the surface. An additional color variation is created by using “ruthenium-black” deposits which are mainly used in bi-color decorative articles.
*'''Rhodium electrolytes''' Rhodium deposits are extremely hard (HV 700 – 1000) and wear resistant. They also excel in light reflection. Both properties are of value for technical as well as decorative applications. While technical applications mainly require hard, stress and crack free coatings, the jewelry industry takes advantage of the light whitish deposits with high corrosion resistance.
*'''Silver electrolytes''' Silver electrolytes without additives generate dull soft deposits (HV ~ 80) which are mainly used as contact layers on connectors with limited insertion and withdrawal cycles. Properties required for decorative purposes such as shiny bright surfaces and higher wear resistance are achieved through various additives to the basic Ag electrolyte.
Table 7.2: Precious Metal Electrolytes for Technical Applications
<table border="1" cellspacing="0" style="border-collapse:collapse"><tr><td><p class="s8">AUROMET TN</p></td><td><p class="s8">3.2 - 4.2</p></td><td><p class="s8">ca. 70</p></td><td><p class="s8">99.99% Au</p></td><td><p class="s8">Base-deposits</p></td></tr><tr><td><p class="s8">AUROMET XPH</p></td><td><p class="s8">0.3 - 0.6</p></td><td><p class="s8">160 - 180</p></td><td><p class="s8">99.8% Au</p></td><td><p class="s8">Base-deposits for stainless steel etc.</p></td></tr><tr><td><p class="s8">DODUREX COC</p></td><td><p class="s8">4.6 - 4.9</p></td><td><p class="s8">160 - 180</p></td><td><p class="s8">99.6% Au</p></td><td><p class="s8">Printed circuit boards, connectors, contact parts, etc.; hard gold coatings for rack and barrel plating</p></td></tr><tr><td><p class="s8">DODUREX HS 100</p></td><td><p class="s8">4.3 - 4.6</p></td><td><p class="s8">160 - 180</p></td><td><p class="s8">99.6% Au</p></td><td><p class="s8">High speed process for connectors and</p><p class="s8">PCB plating</p></td></tr><tr><td><p class="s8">PURAMET 202</p><p class="s8">PURAMET 402</p></td><td><p class="s8">5.5 - 6.5</p><p class="s8">7.0 - 7.5</p></td><td><p class="s8">60 - 80</p><p class="s8">60 - 80</p></td><td><p class="s8">99.99% Au</p><p class="s8">99.99% Au</p></td><td><p class="s8">High purity gold coatings for electrical</p><p class="s8">and electronic parts incl. semi conductors and PCBs; for demanding requirement on bonding properties</p></td></tr></table>
===== Non-Precious Metal Electrolytes=====
