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Changes
→7.2 Coatings from the Gaseous Phase (Vacuum Deposition)
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm)
<figtable id="tab:Characteristics of the Most Important PVD Processes">
</figtable>
The sputtering process has gained the economically most significant usage. Its process principle is illustrated in ''<xr id="fig:"/> (Fig. 7.5)''.
Fig. 7.5: Principle of sputtering Ar = Argon atoms; e = Electrons; M = Metal atoms
<figure id="fig:">[[File:.jpg|right|thumb|Electroless Deposition of Nickel/Gold]]</figure>
Initially a gas discharge is ignited in a low pressure (10 – 1 Pa) argon atmosphere. The argon ions generated are accelerated in an electric field and
impact the target of material to be deposited with high energy. Caused by this energy atoms are released from the target material which condensate on the
