Difference between revisions of "Template:Path"
From Electrical Contacts
Doduco Admin (talk | contribs) |
|||
(37 intermediate revisions by 3 users not shown) | |||
Line 5: | Line 5: | ||
</li> | </li> | ||
− | <div class="accordion-header"><span class="dotted">[[#| | + | <div class="accordion-header"><span class="dotted">[[#|Galvanic deposition]]</span></div> |
<div>For electroplating of metals, especially precious metals, water based solutions (electrolytes) are used which contain the metals to be deposited as ions (i.e. dissolved metal salts). An electric field between the anode and the work pieces as the cathode forces the positively charged metal ions to move to the cathode where they give up their charge and deposit themselves as metal on the surface of the work piece. Depending on the application, for electric and electronic or decorative end use, different electrolytic bath solutions (electrolytes) are used. The electroplating equipment used for precious metal plating and its complexity varies widely depending on the process technologies employed. Electroplating processes are encompassing besides the pure metal deposition also preparative and post treatments of the goods to be coated. An important parameter for creating strongly adhering deposits is the surface of the goods to be metallic clean without oily or oxide film residues. This is achieved through various pre-treatment processes specifically developed for the types of material and surface conditions of the goods to be plated. In the following segments electrolytes – both precious and non-precious – as well as the most widely used electroplating processes are described. | <div>For electroplating of metals, especially precious metals, water based solutions (electrolytes) are used which contain the metals to be deposited as ions (i.e. dissolved metal salts). An electric field between the anode and the work pieces as the cathode forces the positively charged metal ions to move to the cathode where they give up their charge and deposit themselves as metal on the surface of the work piece. Depending on the application, for electric and electronic or decorative end use, different electrolytic bath solutions (electrolytes) are used. The electroplating equipment used for precious metal plating and its complexity varies widely depending on the process technologies employed. Electroplating processes are encompassing besides the pure metal deposition also preparative and post treatments of the goods to be coated. An important parameter for creating strongly adhering deposits is the surface of the goods to be metallic clean without oily or oxide film residues. This is achieved through various pre-treatment processes specifically developed for the types of material and surface conditions of the goods to be plated. In the following segments electrolytes – both precious and non-precious – as well as the most widely used electroplating processes are described. | ||
[[Electroplating_(or_Galvanic_Deposition)|more]] </div> | [[Electroplating_(or_Galvanic_Deposition)|more]] </div> | ||
− | |||
− | |||
− | |||
+ | <div class="accordion-header"><span class="dotted">[[#|PVD]]</span></div> | ||
+ | <div>The term PVD (physical vapor deposition) defines processes of metal, metal alloys, and chemical compounds deposition in a vacuum by adding thermal and kinetic energy through particle bombardment. The main processes are the following four coating variations: | ||
* Vapor deposition | * Vapor deposition | ||
* Sputtering (Cathode atomization) | * Sputtering (Cathode atomization) | ||
* Arc vaporizing | * Arc vaporizing | ||
* Ion implantation | * Ion implantation | ||
− | |||
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm) | In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm) | ||
[[Surface_Coating_Technologies#7.2_Coatings_from_the_Gaseous_Phase_.28Vacuum_Deposition.29|more]] | [[Surface_Coating_Technologies#7.2_Coatings_from_the_Gaseous_Phase_.28Vacuum_Deposition.29|more]] | ||
Line 22: | Line 20: | ||
− | <li> | + | <li> Power technology (typically > 12V >500mA)</li> |
+ | <br /> | ||
− | <div class="accordion-header"><span class="dotted">[[#| | + | <div class="accordion-header"><span class="dotted">[[#|Single-phase alternating current]]</span></div> |
− | |||
− | |||
− | |||
− | |||
<div> | <div> | ||
{|class="pathtable" | {|class="pathtable" | ||
! | ! | ||
− | ! colspan=" | + | ! colspan="5" |Switching current in A |
|- | |- | ||
− | |class=" first " | | + | |class=" first " |Applications |
|class="ordered" | 1 | |class="ordered" | 1 | ||
|class="ordered" | 10 | |class="ordered" | 10 | ||
Line 40: | Line 35: | ||
|class="ordered" | 1000 | |class="ordered" | 1000 | ||
|class="ordered" | 10.000 | |class="ordered" | 10.000 | ||
− | |||
|- | |- | ||
− | |class="other"| | + | |class="other"| Appliance switches |
− | | colspan=" | + | | colspan="5" |<div class="formel level1"><span class="text-formel">[[Silver Based Materials|Ag|AgCu]]<br />[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi0,15]]</span></div><div class="formel level2"><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag/Ni]]</span></div><div class="formel level3"><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/ZnO]]</span></div> |
|- | |- | ||
− | |class="other"| | + | |class="other"| Light switches <br /> |
− | + | Main switches | |
− | | colspan=" | + | | colspan="5" |<div class="formel level1" style="width: 24%;"><span class="text-formel">[[Silver Based Materials|Ag|AgCu]]<br /> [[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi0,15]]</span></div><div class="formel level2" style="width: 20%;"><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/ZnO]]</span></div> |
|- | |- | ||
− | |class="other"| | + | |class="other"|Power relays |
− | | colspan=" | + | | colspan="5" |<div class="formel level1" style="width: 18%;"><span class="text-formel">[[Silver Based Materials|Ag|AgCu]]<br />[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi0,15]]</span></div><div class="formel level2"><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag/Ni]]</span></div><div class="formel level3"><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/ZnO]]</span></div> |
|- | |- | ||
− | |class="other"| | + | |class="other"|Circuit breakers |
− | ( | + | (domestic MCCBs) |
− | | colspan=" | + | | colspan="5" |<div class="formel level1" style="width: 24%;"><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/AgZnO/CdO]]</span></div><div class="formel level2"><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi]]</span></div><div class="formel level3" style="width: 24%;"><span class="text-formel">[[Silver_Based_Materials#Silver.E2.80.93Graphite_.28GRAPHOR.29-Materials|Ag/C]]</span><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag/Ni]]</span></div> |
|- | |- | ||
− | |class="other"| | + | |class="other"|Disconnect, power and motor switches (control relays and contactors) |
− | | colspan=" | + | | colspan="5" |<div class="formel level1" style="width: 24%;" ><span class="text-formel">[[Silver Based Materials|Ag|AgCu]]<br />[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi0,15]]</span></div><div class="formel level2"><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag/Ni]]</span></div><div class="formel level3" style="width: 22%;"><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/AgZnO/CdO]]</span></div> |
|- | |- | ||
− | |class="other" | | + | |class="other" | Heavy-duty switchgear (industrial) |
− | | colspan="6" |<div class="formel level1" style="width: 22%;" ><span class="text-formel">[[#|Ag/SnO<sub>2</sub> | + | | colspan="6" |<div class="formel level1" style="width: 22%;" ><span class="text-formel">[[Silver_Based_Materials#Silver-Metal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub><br />Ag/ZnO]]</span></div><div class="formel level2" style="width: 30%;"><span class="text-formel">[[Silver_Based_Materials#Silver.E2.80.93Graphite_.28GRAPHOR.29-Materials|Ag/C]]</span> <span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|AgNi0,15|Ag/Ni]]</span></div><div class="formel level3" style="width: 47%; border-right: none;"><span class="text-formel">[[Tungsten_and_Molybdenum_Based_Materials|Ag/W, Ag/WC/C<br />Ag/WC]]</span></div> |
|- | |- | ||
− | |class="other"|Automotive | + | |class="other"|Automotive relays and switches |
− | | colspan=" | + | | colspan="5" |<div class="formel level1" ><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag,AgNi0,15]]</span></div><div class="formel level2"><span class="text-formel">[[Silver_Based_Materials#Silver-Nickel_.28SINIDUR.29_Materials|Ag/Ni]]</span></div><div class="formel level3"><span class="text-formel">[[Silver_Based_Materials#SilverMetal_Oxide_Materials_Ag.2FCdO.2C_Ag.2FSnO2.2C_Ag.2FZnO|Ag/SnO<sub>2</sub>]]</span></div> |
|- | |- | ||
|} | |} |
Latest revision as of 09:40, 20 February 2023
- Infomation technology
- Vapor deposition
- Sputtering (Cathode atomization)
- Arc vaporizing
- Ion implantation
- Power technology (typically > 12V >500mA)
For electroplating of metals, especially precious metals, water based solutions (electrolytes) are used which contain the metals to be deposited as ions (i.e. dissolved metal salts). An electric field between the anode and the work pieces as the cathode forces the positively charged metal ions to move to the cathode where they give up their charge and deposit themselves as metal on the surface of the work piece. Depending on the application, for electric and electronic or decorative end use, different electrolytic bath solutions (electrolytes) are used. The electroplating equipment used for precious metal plating and its complexity varies widely depending on the process technologies employed. Electroplating processes are encompassing besides the pure metal deposition also preparative and post treatments of the goods to be coated. An important parameter for creating strongly adhering deposits is the surface of the goods to be metallic clean without oily or oxide film residues. This is achieved through various pre-treatment processes specifically developed for the types of material and surface conditions of the goods to be plated. In the following segments electrolytes – both precious and non-precious – as well as the most widely used electroplating processes are described.
more
The term PVD (physical vapor deposition) defines processes of metal, metal alloys, and chemical compounds deposition in a vacuum by adding thermal and kinetic energy through particle bombardment. The main processes are the following four coating variations:
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm) more
Switching current in A | ||||||
---|---|---|---|---|---|---|
Applications | 1 | 10 | 100 | 1000 | 10.000 | |
Appliance switches | ||||||
Light switches Main switches |
||||||
Power relays | ||||||
Circuit breakers
(domestic MCCBs) |
||||||
Disconnect, power and motor switches (control relays and contactors) | ||||||
Heavy-duty switchgear (industrial) | ||||||
Automotive relays and switches |