Difference between revisions of "Data Book of Electrical Contacts"

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Revision as of 09:53, 28 January 2014

Featured Article

Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
To get your desired information, please use:

For further questions or help, please contact us directly under Contact DODUCO


Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Featured Files

Phase diagram of palladium copper2.jpg


Strain hardening of copper nickel alloys as function.jpg
Strain hardening of copper-nickel alloys as a function of nickel content
Pages: Other Naturally Hard Copper Alloys,
Sonstige naturharte Kupfer-Legierungen

by Doduco Redaktion