Difference between revisions of "Wiki der elektrischen Kontakte"

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Latest revision as of 21:14, 26 September 2014

Willkommen in der neuen Wiki der elektrischen Kontakte

Die Grundlage dieser Wiki ist die 2012er Ausgabe des "DODUCO Datenbuch der elektrischen Kontakte", welches auch in gedruckter Form erhältlich ist.
Um Ihre gewünschten Informationen zu erhalten, nutzen Sie bitte:


Für weitere Fragen oder Hilfe kontaktieren Sie uns bitte direkt unter DODUCO Kontakt


Zufälliger Artikel

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Zufällige Dateien

Micro structure of Ag ZnO 92 8 Pw25.jpg
Micro structure of Ag/ZnO 92/8 Pw25: a) perpendicular to extrusion direction b) parallel to extrusion direction
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion


Precipitation hardening of CuBe2 at 325C.jpg
Precipitation hardening of CuBe2 at 325°C after different cold working
Pages: Precipitation Hardening Copper Alloys,
Aushärtbare Kupfer-Legierungen

by Doduco Redaktion