210
edits
Changes
no edit summary
The wire bonding – a welding process of fine wires onto flat semiconductors and metal surfaces – was developed for contacting semiconductor
components (see Chapter [[Applications for Bonding Technologies|Applications for Bonding Technologies. ]]) Depending on the application the reliability of the bond connections over extended time periods under difficult environmental conditions is of great importance. The quality of such connections can only be evaluated in destructive pull or shear tests.
*Pull Test
==References==
[[Testing Procedures#References|References]]
[[de:Prüfung_von_Kontaktschichten]]
