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Surface Coating Technologies

574 bytes added, 15:22, 10 April 2014
7.3 Comparison of Deposition Processes
==7.3 Comparison of Deposition Processes==
The individual deposition processes have in part different performance characteristics. For each end application the optimal process has to be chosen
considering all technical and economical factors. The main selection criteria should be based on the electrical and mechanical requirements for the contact layer and on the design characteristics of the contact component. <xr id="tab:Comparison of different coating processes"/> Table 7.7 gives some indications for a comparative evaluation of the different coating processes.
The electroless metal coating is not covered here because of the low thickness of deposits which makes them in most cases not suitable for contact
Table 7.7: Comparison of different coating processes
 
<figtable id="tab:Comparison of different coating processes">
'''Table 7.7: Comparison of different coating processes'''
 
{| class="twocolortable" style="text-align: left; font-size: 12px"
|-
!Process/Coating Properties
!Mechanical Processes (Cladding)
!Electroplating
!Vaccum Deposition (Sputtering)
|-
|Coating material
|formabe metal and alloys
|metals, alloys only limited
|metals and alloys
|-
|Coating thickness
|> 1μm
|0.1 - approx. 10 μm (in special cases up to 100 μm)
|0.1 approx. 10 μm
|}
</figtable>
The main differences between the coating processes are found in the coating materials and thickness. While mechanical cladding and sputtering allow the