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→7.2 Coatings from the Gaseous Phase (Vacuum Deposition)
[[File:Principle of sputtering.jpg|right|thumb|Principle of sputtering Ar = Argon atoms; e = Electrons; M = Metal atoms]]
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Initially a gas discharge is ignited in a low pressure (10 – <sup>-1</sup> -1 Pa) argon atmosphere. The argon ions generated are accelerated in an electric field and
impact the target of material to be deposited with high energy. Caused by this energy atoms are released from the target material which condensate on the
oppositely arranged anode (the substrate) and form a layer with high adhesion strength. Through an overlapping magnetic field at the target location the
The advantages of the PVD processes and especially sputtering for electrical contact applications are:
*High purity of the deposit layers *Low thermal impact on the substrate *Almost unlimited coating materials substrate*Low coating thickness tolerance *Excellent adhesion (also by using additional intermediate layers)
Coatings produced by PVD processes are used for contact applications, for example on miniature-profiles, in electrical engineering and for electronic