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→7.2 Coatings from the Gaseous Phase (Vacuum Deposition)
==7.2 Coatings from the Gaseous Phase (Vacuum Deposition)==
The term PVD (physical vapor deposition) defines processes of metal, metal alloys, and chemical compounds deposition in a vacuum by adding thermal andkinetic energy through particle bombardment. The main processes are the following four coating variations ''<xr id="tab:Characteristics of the Most Important PVD Processes"/> (Table 7.6)'':
*Vapor deposition *Sputtering (Cathode atomization)*Arc vaporizing *Ion implantation
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm)
The sputtering process has gained the economically most significant usage. Its process principle is illustrated in ''(Fig. 7.5)''.