== Wire Bonding==

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Besides electroplated or chemically deposited gold coatings, AlSi clad semi- finished materials are used for layered systems on circuit carriers and in hybrid housings (or for lead frames). These strip materials are manufactured by cold roll cladding of an AlSi1 alloy material onto Cu or Cu alloy strip (see chapter [[Manufacturing_of_Semi-Finished_Materials|Manufacturing of Semi-Finished Materials]]).

*Solderability

Printed circuit boards are also used as circuit carriers. Since many of the conductive structures on the PCB are not electrically connected, the final surface coatings are produced using an electroless process (<xr id="fig:Electroless deposition on a printed circuit board"/>). (Chapter [[Electroless_Plating|Electroless Plating]]). Besides bonding to Nickel/Gold surfaces, soldering is the most widely used process to create conductive connections. This can also be performed on electroless deposited tin surface coatings.