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Applications for Bonding Technologies

1 byte added, 09:09, 22 November 2022
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To achieve a strong metallurgical bond between these two components a suitable surface preparation of the carrier strip and a high degree of deformation are required, followed by diffusion annealing of the clad strip.
Depending on the requirements of the assembly technology for the final product, i.e. using connectors or soldering attachment, the clad strips are coated in the terminal area with a suitable surface layer with either an electroplated hard gold (AuCo0.3) layer or selectively by electroplating or hot dip tinning with pure tin or a tin alloy. To ensure the best bond properties during the coating process , the AlSi surface is protected against corrosion by masking during this processing step.
*'''Examples of AlSi clad strips for bond connections'''