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Applications for Bonding Technologies

107 bytes removed, 15:45, 15 April 2014
AlSi Clad Strip for Bond Connections
*'''Materials'''
<table border{| class="1" cellspacing="0twocolortable" style="bordertext-align: left; font-collapsesize: 12px;width:collapse70%"><tr><td><p class="s7">|-|Inlay cladding</p></td><td><p class="s7">AISi1</p></td></tr><tr><td><p class="s7">|AISi 1|-|Substrate materials</p></td><td><p class="s7">|Cu, CuFe2P, CuSn6 others</p></td></tr></table>|}
*'''Dimensions (typical values)'''