Open main menu

Electrical Contacts β

Changes

Electroplating (or Galvanic Deposition)

620 bytes removed, 17:58, 7 April 2014
Selective Electroplating
*'''Materials'''
<table border{| class="1" cellspacing="0twocolortable" style="bordertext-collapsealign:collapseleft; font-size: 12px;width:70%"><tr><td><p class="s8">|-!Type of Coatings</p></td><td><p class="s8">!Coating Thickness</p></td><td><p class="s8">!Remarks</p></td></tr><tr><td><p class|-|colspan="s8">Precious Metals</p></td><td/><td/></tr><tr><td><p class="s83">|'''Gold electrolytes'''|Pure gold<br /p><p class="s8">Hard gold (AuCo 0.3)</p></td><td><p class="s8">|0.1 - 3 µm</p></td><td><p class="s8">μm|In special cases up to 10 µm</p></td></tr><tr><td><p class="s8">μm|-|Palladium-nickel (PdNi20)</p></td><td><p class="s8">|0.1 - 5 µm</p></td><td><p class="s8">μm|Frequently with additional 0.2 µm μm AuCo 0.3</p></td></tr><tr><td><p class="s8">|-|Silver</p></td><td><p class="s8">|0.5 - 10 µm</p></td><td><p class="s8">μm|In special cases up to 40 µm</p></td></tr><tr><td><p classμm|-|colspan="s83">|'''Non-precious Metals</p></td><td/><td/></tr><tr><td><p class="s8">'''|-|Nickel</p></td><td><p class="s8">|0.5 - 4 µm</p></td><td><p class="s8">μm|Diffusion barrier especially for gold layers</p></td></tr><tr><td><p class="s8">|-|Copper</p></td><td><p class="s8">|1 - 5 µm</p></td><td><p class="s8">μm|Intermediate layer used in tinning of CuZn</p></td></tr><tr><td><p class="s8">|-|Tin, tin alloys</p></td><td><p class="s8">|0.8 - 25 µm</p></td><td><p class="s8">μm|materials</p></td></tr></table>|}
*'''Carrier Materials'''