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→Copper–Tungsten (CUWODUR) Materials
=== Copper–Tungsten (CUWODUR) Materials===
Copper–tungsten (CUWODUR) materials with typically 50-85 wt% tungsten are produced by the infiltration process with the tungsten particle size selected
according to the end application ''[[#figures4|(Figs. 43 – 75)]] (Figs. 2.138 – 2.141) (Table 2.39)''. To increase the wettability of the tungsten skeleton by copper a small amount of nickel < 1 wt% is added to the starting powder mix.
W/Cu materials exhibit a very high arc erosion resistance <xr id="tab:tab2.40"/> (Table 2.40). Compared to silver–tungsten materials they are however less suitable to carry permanent current.
2-teilig
<div id="figures4"><xr id="fig:fig2.139"/> Fig. 2.139: Micro structure of W/Cu 70/30 G[[File<xr id="fig:Micro structure of W Cu 70 30 Gfig2.jpg|right|thumb|Micro structure of W/Cu 70140"/30 G]]> Fig. 2.140: Micro structure of W/Cu 70/30 H[[File<xr id="fig:Micro structure of W Cu 70 30 Hfig2.jpg|right|thumb|Micro structure of W/Cu 70138"/30 H]]> Fig. 2.138: Micro structure of W/Cu 70/30 F [[File<xr id="fig:Micro structure of W Cu 70 30 Ffig2.jpg|right|thumb|Micro structure of W141"/Cu 70/30 F]]> Fig. 2.141: Micro structure of W/Cu 80/20 H[[File:Micro structure of W Cu 80 20 H.jpg|right|thumb|Micro structure of W</Cu 80/20 H]]div>
<div class="multiple-images">
<figure id="fig:fig2.139">
[[File:Micro structure of W Cu 70 30 G.jpg|left|thumb|<caption>Micro structure of W/Cu 70/30 G</caption>]]
</figure>
<figure id="fig:fig2.140">
[[File:Micro structure of W Cu 70 30 H.jpg|left|thumb|<caption>Micro structure of W/Cu 70/30 H</caption>]]
</figure>
<figure id="fig:fig2.138">
[[File:Micro structure of W Cu 70 30 F.jpg|left|thumb|<caption>Micro structure of W/Cu 70/30 F</caption>]]
</figure>
<figure id="fig:fig2.141">
[[File:Micro structure of W Cu 80 20 H.jpg|left|thumb|<caption>Micro structure of W/Cu 80/20 H</caption>]]
</figure>
</div>
<div class="clear"></div>
