Changes

During ''cold bonding'' and heading the bond between the contact material and the copper is achieved without external heat energy by high plastic deformation at the face surfaces of the two wire segments <xr id="fig:Cold_bonding_of_bimetall_rivets"/> (Fig. 3.1). <figure id="fig:Cold_bonding_of_bimetall_rivets">[[File:Cold_bonding_of_bimetall_rivets.jpg|right|thumb|Cold bonding of bimetall rivets (schematic)]]</figure> The bonding pressure must be high enough to move the lattice components of the two metals within a few atom radii so that the adhesion forces between atoms become effective.

<figure id="fig:Cold_bonding_of_bimetall_rivets">[[File:Cold_bonding_of_bimetall_rivets.jpg|right|thumb|Cold bonding of bimetall rivets (schematic)]]</figure>During ''hot bonding'' the required heat energy is applied by a short term electrical current pulse <xr id="fig:Hot_bonding_of_bimetal_rivets"/> (Fig. 3.2). <figure id="fig:Hot_bonding_of_bimetal_rivets">[[File:Hot_bonding_of_bimetal_rivets.jpg|right|thumb|Hot bonding of bimetall rivets (schematic)]]</figure> In the case of Ag and Cu a molten eutectic alloy of silver and copper is formed in the constriction area between the two wire ends. When using metal oxide containing contact materials the non-soluble oxide particles tend to coagulate and the bonding strength between the component materials is greatly reduced. Therefore the cold bonding technology is preferred for these contact materials. The during cold bonding required high surface deformation ratio can be reduced for the hot bonding process which allows the head to shank diameter ratio to be reduced below 2:1.