Changes

*Contact materialsbild<br />Au-Alloys, Pd-Alloys, Ag-Alloys, Ag/Ni (SINIDUR), Ag/CdO (DODURIT CdO), Ag/SnO₂ (SISTADOX), Ag/ZnO (DODURIT ZnO)<br />

*Carrier materialsbild<br />(weldable substrate material for multi-layer materials) Cu, Ni, CuNiFe, CuNiZn, CuSn, CuNiSn, NiCuFe<br />

*Brazing alloybild<br />L-Ag15P<br />

*Quality criteria<br />Beause of the variety of configurations of contact profiles usually the qualityissues are separately agreed upon between the manufacturer and the user.<br />

*Dimensions and tolerances<br />The thickness of the Au top-layer, which is sputtered for example, is between 0.2and 5 μm, depending on the requirements. Tolerance of thickness is about + 10%.<br />