Semi-finished contact pre-materials can be manufactured from solid preciousmetals, precious metal alloys, or precious metal containing composite materials.They are made in wire, strip, and profile form by known processing technologiessuch as extrusion and subsequent annealing and drawing or roll-forming. Theyare supplied following the manufacturer's internal standards usually related toDIN EN specifications for copper based materials. The most important materialsare two – or multiple material layered semi-finished materials with the contactmaterial bonded in its solid phase to non-precious carriers by cladding, brazing,or welding. The contact material can also be deposited on the carrier from the
liquid or vapor phase.
===Clad Semi-Finished Pre-Materials (Contact-Bimetals)===
Clad materials consist of two or more layers of different materials, the contactmaterial and the carrier, which are firmly bonded to each other. Depending onthe electrical requirements the contact material is mainly an alloy of gold,palladium, or silver based , while the carrier material are mainly copper alloys. Tobond these materials , various technologies are utilized, the two most importantones being described in more detail below.
During ''hot cladding'', the classic process, the materials to be clad areassembled into a cladding package in block or plate form, heated to about800°C and clad (or “welded”"welded") together under high pressure ''(<xr id="fig:Hot_cladding_of_pre_materials"/><!--(Fig. 3.3)''-->). At theinterface between the two materials , a non-separable bond is formed by eitherdiffusion of the reaction partners or in liquid phase by forming a AgCu eutecticalloy when an additional brazing alloy foil is placed between the two materials.Further processing is done by rolling with required annealing steps betweensubsequent thickness reductions. The disadvantage of this process is theusually limited short length of final material strips.
In the ''Cold Roll-Cladding'' process, the bond between the contact and carrier material is achieved by cold deformation of > 50% in one rolling pass (<xr id="fig:Cold roll-cladding of semi-finished strips (schematic)"/><!-- (Fig. 3.3 Hot cladding 4)-->). The high plastic deformation causes cold welding in the boundary layer between the two materials. To increase the quality and strength of prethe bond, a subsequent diffusion annealing is performed in most cases. This process is most suitable for clad semi-materials finished strips with thin contact material layers (≥ 2 μm) and large strip length (schematic> 100 m).
[[File:Hot cladding *Typical configurations of pre-materials clad contact strips (schematisch).jpg|right|thumb|Hot cladding <xr id="fig:Typical configurations of pre-materials (schematischclad contact strips"/>)]]
In the ''Cold Roll*Contact materials <br />Ag, Ag-Cladding'' process the bond between the contact and carriermaterial is achieved by cold deformation of > 50% in one rolling pass ''(Fig. 3.4)''alloys.The high plastic deformation causes cold welding , Ag/Ni, in the boundary layer betweenthe two materials. To increase the quality and strength of the bond a subsequentdiffusion annealing is performed in most special cases. This process is most suitable forclad semi-finished strips with thin contact material layers (also Ag/SnO<sub> 2 μm) </sub> and large striplength (Ag/ZnO <br /> 100 m).
Fig*Carrier materials: Cu, CuSn, CuNiZn, CuNiSn, CuFe, CuBe et al. 3.4: Cold roll-cladding of semi-finished strips (schematic)
[[File*Dimensions (<xr id="fig:Cold roll-cladding of semi-finished strips (schematic).jpg|right|thumb|Cold roll-cladding of semi-finished strips (schematicDimensions"/>)]]
*Typical configurations of clad When specifying the contact stripsmaterial layer thickness it is recommended to use the minimum required thickness.
bild*Quality criteria and tolerances [[File:Typical configurations Strength properties and dimensional tolerances of clad contact strips.jpg|right|thumb|Typical configurations of clad contact strips]] *Contact materials <br />Ag, Agbi-metals are derived from the standards DIN EN 1652 and DIN EN 1654 for Cu alloys., Ag/Ni (SINIDUR), in special cases also Ag/CdO (DODURIT CdO), Ag/SnO<sub>2</sub> (SISTADOX), Ag/ZnO (DODURIT ZnO)<br /> *Carrier materialskein text *Dimensions bild [[File:Dimensions.jpg|right|thumb|Dimensions]] When specifying the width of the contact material layer thickness , it is recommended to use theminimum required thicknessvalue. All dimensions should be specified originating from one strip edge.
*Quality criteria and tolerances<div class="multiple-images"><figure id="fig:Hot_cladding_of_pre_materials">[[File:Hot cladding of pre-materials (schematisch).jpg|right|thumb|Figure 1: Hot cladding of pre-materials (schematic)]]</figure>Strength properties and dimensional tolerances <figure id="fig:Cold roll-cladding of clad contact bisemi-metals arefinished strips (schematic)">derived from the standards DIN EN 1652 and DIN EN 1654 for Cu alloys[[File:Cold roll-cladding of semi-finished strips (schematic). Whenjpg|right|thumb|Figure 2: Cold roll-cladding of semi-finished strips (schematic)]]</figure>specifying the width <figure id="fig:Typical configurations of the clad contact material layer it is recommended to use thestrips">minimum required value[[File:Typical configurations of clad contact strips. All dimensions should be specified originating from onejpg|right|thumb|Figure 3: Typical configurations of clad contact strips]]</figure>strip edge<figure id="fig:Dimensions">[[File:Dimensions.jpg|right|thumb|Figure 4: Dimensions]]</figure></div><div class="clear"></div>
=== Brazed Semi-Finished Contact Materials (Toplay–Profiles)===
The toplay process starts with a flat or profile – shaped contact material stripwhich is fed together with the wider non-precious carrier material and in mostcases an intermediate thin foil of brazing alloy into a induction brazing machine''(<xr id="fig:Toplay brazing with an inductive heating inline equipment (schematic)"/><!--(Fig. 3.5)''-->). An evenly distributed and reliable braze joint can be achieved this waybetween contact and carrier materials. The combined material strip is rather softafter the brazing process and re-hardened during a subsequent profile rollingstep. In this way different shapes and configurations can easily be achieved. Fig. 3.5: Toplay brazing with an inductive heating inline equipment (schematic)
[[File*Typical configurations of toplay contact profiles (<xr id="fig:Toplay brazing with an inductive heating inline equipment (schematic).jpg|right|thumb|Toplay brazing with an inductive heating inline equipment (schematicTypical configurations of toplay contact profiles2"/>)]]
*Typical configurations of toplay contact profilesbildContact materials <br />Ag, AgNi 0,15, AgCu, AgCuNi (ARGODUR 27), Ag/Ni, Ag/SnO<sub>2</sub> and Ag/ZnO<br />
[[File*Carrier materials:Typical configurations of toplay contact profiles2Cu, CuZn, CuSn et al.jpg|right|thumb|Typical configurations of toplay contact profiles]]<br />
*Contact materials <br />Ag, AgNi 0,15 (ARGODUR)Quality criteria, AgCu, AgCuNi dimensions and tolerances (ARGODUR 27), Ag/Ni (SINIDUR),Ag/CdO (DODURIT CdO), Ag/SnO<sub>2<xr id="fig:Quality criteria dimensions and tolerances"/sub> (SISTADOX), Ag/ZnO (DODURIT ZnO)<br />
*Carrier materials <br />Strength properties and dimensional tolerances of toplay profiles are derived from the standards DIN EN 1652 and DIN EN 1654 for Cu, CuZn, CuSn et alalloys.<br />
*Quality criteria, dimensions and tolerancesbild<div class="multiple-images"><figure id="fig:Toplay brazing with an inductive heating inline equipment (schematic)">[[File:Quality criteria dimensions and tolerancesToplay brazing with an inductive heating inline equipment (schematic).jpg|right|thumb|Quality criteria dimensions and tolerancesFigure 5: Toplay brazing with an inductive heating inline equipment (schematic)]]</figure>Strength properties and dimensional tolerances of toplay profiles are derivedfrom the standards DIN EN 1652 and DIN EN 1654 for Cu alloys. <figure id=== Seam–Welded Contact Strip Materials (FDR–Profiles)===Seam–welding is the process by which the contact material in the form of a solidwire, narrow clad strip, or profile is attached to the carrier strip by overlapping orcontinuous weld pulses between rolling electrodes ''(Fig. 3.6)''. The weld joint iscreated by simultaneous effects of heat and pressure. Except for the very smallactual weld joint area the original hardness of the carrier strip is maintainedbecause of the limited short time of the heat supply. Therefore also spring-hardbase materials can be used without loss of their mechanical strength. The use ofclad contact pre-materials and profiles allows to minimize the use of the costlyprecious metal component tailored to the need for optimum reliability over theexpected electrical life of the contact components. *"fig:Typical configurations of seam–welded toplay contact strips and stamped partsbildprofiles2">[[File:Typical configurations of seam-welded toplay contact stripsprofiles2.jpg|right|thumb|Figure 6: Typical configurations of seam-welded toplay contact stripsprofiles]]</figure>Fig. 3.6<figure id="fig: Seam-welding process (schematic)Quality criteria dimensions and tolerances">[[File:Seam-welding process (schematic)Quality criteria dimensions and tolerances.jpg|right|thumb|Seam-welding process (schematic)Figure 7: Quality criteria dimensions and tolerances]] *Contact materials <br /figure>Au-Alloys, Pd-Alloys, Ag, AgNi 0,15 (ARGODUR), AgCu, AgCuNi (ARGODUR 27), Ag/Ni (SINIDUR), Ag/CdO (DODURIT CdO), Ag/SnO<sub>2</sub> (SISTADOX), Ag/ZnO (DODURIT ZnO)<br /div> *Carrier materials <br /div class="clear">Cu, CuSn, CuZn, CuNiZn, CuBe et al.<br /div> *Dimensionsbild [[File:Contact Profiles Dimensions.jpg|right|thumb|Contact Profiles Dimensions]] *Quality criteria and tolerancesStrength properties and dimensional tolerances of toplay profiles are derived from thestandards DIN EN 1652 and DIN EN 1654 for Cu alloys..
=== Contact Profiles (Contact Weld Tapes)===
Contact profiles span a broad range of dimensions. Width and thickness are typicallybetween 0.8 – 8.0 mm and 0.2 – 3.0 mm resp. Special configurations, often definedas miniature-profiles or even micro–profiles can have awidth < 2.0 mm. Miniature–profiles are mostly composed of a contact-bimetal material with the contactmaterial being a precious metal alloy or composite material clad, welded or coated byelectroplating or vacuum-deposition (sputtered) onto a weldable base material. Sincethese profiles are attached to carrier strip materials usually by segment– or seam–welding to the base materials, materials with good welding properties such as nickel,copper-nickel, copper-tin, as well as copper-nickel-zinc alloys are used. The bottomsurface of the profiles usually has formed weld rails or similar patterns to ensure asolid continuous metallurgical weld joint between the profile and the contact carrier. Contact profiles in larger sizes are often used for switching devices in the low voltagetechnology. For these the contact layer mostly consists of arc erosion resistantmaterials such as silver–nickel, silver–metal oxides or the weld resistant silver–graphite. The brazable or weldable underside of the metal oxide or silver–graphitematerials is usually pure silver with also quite often a thin layer of a phosphorouscontaining brazing alloy applied to aid the welding process.
*Typical configurations Miniature–profiles are mostly composed of multia contact-layer bimetal material with the contact material being a precious metal alloy or composite material clad, welded or coated by electroplating or vacuum-deposition (sputtered) onto a weldable base material. Since these profilesare attached to carrier strip materials, usually by segment– or seam– welding to the base materials, materials with good welding properties such as nickel, copper-nickel, copper-tin, as well as copper-nickel-zinc alloys are used. The bottom surface of the profiles usually has formed weld rails or similar patterns to ensure a solid continuous metallurgical weld joint between the profile and the contact carrier.
bildContact profiles in larger sizes are often used for switching devices in the low voltage technology. For these, the contact layer mostly consists of arc erosion resistant materials such as silver–nickel, silver–metal oxides or the weld resistant silver– graphite. The brazable or weldable underside of the metal oxide or silver–graphite materials is usually pure silver with also quite often a thin layer of a phosphorous containing brazing alloy applied to aid the welding process.
[[File:*Typical configurations of multi-layer contact profiles.jpg|right|thumb|(<xr id="fig:Typical configurations of multi-layer contact profiles]]"/>)
*Contact materials <br />Au-Alloys, Pd-Alloys, Ag-Alloys, Ag/Ni (SINIDUR), Ag/CdO (DODURIT CdO), Ag/SnO<sub>2</sub> (SISTADOX), Ag/ZnO (DODURIT ZnO)<br />
*Carrier materials <br />(weldable substrate material for multi-layer materials) Cu, Ni, CuNiFe, CuNiZn, CuSn, CuNiSn, NiCuFe<br />
*Brazing alloy <br />L-Ag15P<br />
*Quality criteria <br />Beause of the variety of configurations of contact profiles , usually the quality issues are separately agreed upon between the manufacturer and the user.<br />
*Dimensions and tolerances (<br xr id="fig:Contact Profiles Dimensions and tolerances"/>)The thickness of the Au top-layer, which is sputtered for example, is between 0.2 and 5 μm, depending on the requirements. Tolerance of thickness is about + ± 10%. <div class="multiple-images"><figure id="fig:Typical configurations of multi-layer contact profiles">[[File:Typical configurations of multi-layer contact profiles.jpg|right|thumb|Figure 8: Typical configurations of multi-layer contact profiles]]<br /figure>bild<figure id="fig:Contact Profiles Dimensions and tolerances">[[CategoryFile:Manufacturing Technologies for Contact PartsProfiles Dimensions and tolerances.jpg|Categoryright|thumb|Figure 9: Contact Profiles Dimensions and tolerances]]</figure></div><div class="clear"></div>
==References==
[[:Manufacturing Technologies for Contact Parts#References|References]]
[[de:Herstellung_von_Halbzeugen]]
