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<table border="1" cellspacing="0" style="border-collapse:collapse"><tr><td><p class="s11">Designation</p></td><td><p class="s11">Composition Au</p><p class="s11">(min. content)</p></td><td><p class="s11">Impurites ppm</p></td><td><p class="s12">Remarks on forms and application</p></td></tr><tr><td><p class="s11">Electronic Glod</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu < 3</p><p class="s11">Ag < 3</p><p class="s11">Ca < 1</p><p class="s11">Mg <1</p><p class="s11">Fe < 1</p></td><td><p class="s12">Wires, strips, alloying metal for semiconductors, electronic components</p></td></tr><tr><td><p class="s11">Pure Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu < 10</p><p class="s11">Ag < 15</p><p class="s11">Ca < 20</p><p class="s11">Mg < 10</p><p class="s11">Fe < 3</p><p class="s11">Si < 10</p><p class="s11">Pb < 20</p></td><td><p class="s12">Granulate for high purity alloys, strips, tubing, profiles</p></td></tr><tr><td><p class="s11">Ingot Grade-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu < 100</p><p class="s11">Ag < 150</p><p class="s11">Ca < 50</p><p class="s11">Mg < 50</p><p class="s11">Fe < 30</p><p class="s11">Si < 10</p></td><td><p class="s12">Alloys, commonly used grade</p></td></tr></table>
Fig. 2.3: Phase diagram of goldplatinum
[[File:Phase diagram of goldplatinum.jpg|right|thumb|Phase diagram of goldplatinum]]
Fig. 2.34:Phase diagramof goldplatinumgold-silver
[[File:Phase diagram of gold-silver.jpg|right|thumb|Phase diagram of gold-silver]]
Fig. 2.6: Phase diagram of gold-nickel
Fig. 2.7: Phase diagram of gold-cobalt
Fig. 2.8:Strain hardeningof Au by cold working
Fig. 2.9:Softening of Au after annealingfor 0.5 hrs after 80%cold working
Fig. 2.10:Strain hardening ofAuPt10 by cold working
Fig. 2.11:Strain hardeningof AuAg20 by cold working
Fig. 2.12:Strain hardening ofAuAg30 by cold working
Fig. 2.13:Strain hardening of AuNi5by cold working
Fig. 2.14:Softeningof AuNi5 after annealingfor 0.5 hrs after 80%cold working
Fig. 2.15:Strain hardeningof AuCo5 by cold working
Fig. 2.16:Precipitation hardening ofAuCo5 at 400°C hardeningtemperature
Fig. 2.17:Strain hardeningof AuAg25Pt6 by cold working
Fig. 2.18:Strain hardeningof AuAg26Ni3 by cold working
Fig. 2.19:Softeningof AuAg26Ni3 afterannealing for 0.5 hrsafter 80% coldworking
Fig. 2.20:Strain hardening ofAuAg25Cu5by cold working
Fig. 2.21:Strain hardening ofAuAg20Cu10by cold working
Fig. 2.22:Softeningof AuAg20Cu10 afterannealing for 0.5 hrsafter 80% cold working
Fig. 2.23:Strain hardening ofAuCu14Pt9Ag4by cold working
Fig. 2.24:Precipitationhardening ofAuCu14Pt9Ag4at differenthardeningtemperaturesafter 50%cold working
==References==
[[Contact Materials for Electrical Engineering#References|References]]
