Changes

</figure>

For special applications, such as for example electronic component substrates, a dot shaped precious metal coating is required. This is achieved with two belt masks running synchronous to the carrier material. One of these two masks has windows which are open to the spot areas targeted for precious metal plating coverage.

'''Summary of the processes for selective electroplating'''

*'''Immersion electroplating'''

Overall or selective electroplating of both sides of solid strips or pre-stamped parts in strip form

*'''Stripe electroplating'''

Stripe electroplating on solid strips through wheel cells or using masking techniques

*'''Selective electroplating'''

One-sided selective coating of solid, pre-stamped, or metallically belt-linked strips by brush plating

*'''Spot electroplating'''

Electroplating in spots of solid strips with guide holes or pre-stamped parts in strip form

'''Typical examples of electroplated semi-finished materials'''

|-

|colspan="3" |'''Gold electrolytes'''

|Pure gold<br />Hard gold (AuCo 0.3)

|0.1 - 3 μm

|materials

|}

*'''Carrier Materials'''

Copper, copper alloys, nickel, nickel alloys, stainless steel

*'''Dimensions and Tolerances'''