Difference between revisions of "Contact Materials for Electrical Engineering"

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===2.1 Introduction===
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The contact parts are important components in switching devices. They have to maintain their function from the new state until the end of the functional life of the devices.
The contact parts are important components in switching devices. They have to
 
maintain their function from the new state until the end of the functional life of the
 
devices.
 
  
The requirements on contacts are rather broad. Besides typical contact properties
+
The requirements on contacts are rather broad. Besides typical contact properties such as
such as
 
  
 
*High arc erosion resistance
 
*High arc erosion resistance
Line 13: Line 9:
 
*Good arc extinguishing capability
 
*Good arc extinguishing capability
  
they have to exhibit physical, mechanical, and chemical properties like high electrical
+
They have to exhibit physical, mechanical and chemical properties like high electrical and thermal conductivity, high hardness, high corrosion resistance etc. and besides this, should have good mechanical workability and also be suitable for good weld and brazing attachment to contact carriers. In addition they must be made from environmentally friendly materials.
and thermal conductivity, high hardness, high corrosion resistance, etc and besides
 
this should have good mechanical workability, and also be suitable for good weld and
 
brazing attachment to contact carriers. In addition they must be made from
 
environmentally friendly materials.
 
  
Materials suited for use as electrical contacts can be divided into the following groups
+
Materials suited for use as electrical contacts can be divided into the following groups based on their composition and metallurgical structure:
based on their composition and metallurgical structure:
 
  
 
*Pure metals
 
*Pure metals
 
*Alloys
 
*Alloys
 
*Composite materials
 
*Composite materials
*Pure metals
 
  
From this group silver has the greatest importance for switching devices in the higher
 
energy technology. Other precious metals such as gold and platinum are only used in
 
applications for the information technology in the form of thin surface layers. As a nonprecious
 
metal tungsten is used for some special applications such as for example as
 
automotive horn contacts. In some rarer cases pure copper is used but mainly paired
 
to a silver-based contact material.
 
  
*Alloys
+
'''Pure metals'''
 +
 
 +
Within this group, silver has the greatest importance for switching devices in the higher energy technology. Other precious metals such as gold and platinum are only used in applications for the information technology in the form of thin surface layers. As a nonprecious metal, tungsten is used for some special applications such as, for example, automotive horn contacts. In some rarer cases, pure copper is used, but mainly paired to a silver-based contact material.
 +
 
 +
'''Alloys'''
 +
 
 +
Besides these few pure metals, a larger number of alloy materials made by melt technology are available for the use as contacts. An alloy is characterized by the fact, that its components are completely or partially soluble in each other in the solid state. Phase diagrams for multiple metal compositions show the number and type of the crystal structure as a function of the temperature and composition of the alloying components.
  
Besides these few pure metals a larger number of alloy materials made by melt
+
They indicate the boundaries of liquid and solid phases and define the parameters of solidification.
technology are available for the use as contacts. An alloy is characterized by the fact
+
Alloying allows to improve the properties of one material at the cost of changing them for the second material. As an example, the hardness of a base metal may be increased while at the same time the electrical conductivity decreases with even small additions of the second alloying component.
that its components are completely or partially soluble in each other in the solid state.
 
Phase diagrams for multiple metal compositions show the number and type of the
 
crystal structure as a function of the temperature and composition of the alloying components.
 
  
They indicate the boundaries of liquid and solid phases and define the
+
'''Composite Materials'''
parameters of solidification.
 
Alloying allows to improve the properties of one material at the cost of changing
 
them for the second material. As an example, the hardness of a base metal may
 
be increased while at the same time the electrical conductivity decreases with
 
even small additions of the second alloying component.
 
  
*Composite Materials
+
Composite materials are a material group whose properties are of great importance for electrical contacts that are used in switching devices for higher
 +
electrical currents.
  
Composite materials are a material group whose properties are of great
+
Those used in electrical contacts are heterogeneous materials, composed of two or more uniformly dispersed components, in which the largest volume portion consists of a metal.
importance for electrical contacts that are used in switching devices for higher
 
electrical currents.
 
Those used in electrical contacts are heterogeneous materials composed of two
 
or more uniformly dispersed components in which the largest volume portion
 
consists of a metal.
 
The properties of composite materials are determined mainly independent from
 
each other by the properties of their individual components. Therefore it is for
 
example possible to combine the high melting point and arc erosion resistance
 
of tungsten with the low melting and good electrical conductivity of copper, or
 
the high conductivity of silver with the weld resistant metalloid graphite.
 
  
Figure 2.1 shows the schematic manufacturing processes from powder
+
The properties of composite materials are determined mainly independent from each other by the properties of their individual components. Therefore it is, for example, possible to combine the high melting point and arc erosion resistance of tungsten with the low melting and good electrical conductivity of copper or the high conductivity of silver with the weld resistant metalloid graphite. <xr id="fig:Powder metallurgical manufacturing of composite materials (schematic)"/> shows the schematic manufacturing processes from powder blending to contact material. Three basic process variations are typically applied:
blending to contact material. Three basic process variations are typically
 
applied:
 
  
 
*Sintering without liquid phase (Press-Sinter-Repress, PSR)
 
*Sintering without liquid phase (Press-Sinter-Repress, PSR)
Line 71: Line 42:
 
*Infiltration (Press-Sinter-Infiltrate, PSI)
 
*Infiltration (Press-Sinter-Infiltrate, PSI)
  
During sintering without a liquid phase (left side of schematic) the powder mix is
+
<figure id="fig:Powder metallurgical manufacturing of composite materials (schematic)">
first densified by pressing, then undergoes a heat treatment (sintering), and
+
[[File:Powder metallurgical manufacturing of composite materials (schematic).jpg|thumb|<caption>Powder-metallurgical manufacturing of composite materials (schematic) T<sub>s</sub> = Melting point of the lower melting component)</caption>]]
eventually is re-pressed again to further increase the density. The sintering
+
</figure>
atmosphere depends on the material components and later application; a
 
vacuum is used for example for the low gas content material Cu/Cr. This
 
process is used for individual contact parts and also termed press-sinterrepress
 
(PSR). For materials with high silver content the starting point at
 
pressing is most a larger block (or billet) which is then after sintering hot
 
extruded into wire, rod, or strip form. The extrusion further increases the density
 
of these composite materials and contributes to higher arc erosion resistance.
 
Materials such as Ag/Ni, Ag/MeO, and Ag/C are typically produced by this
 
process.
 
 
 
Sintering with liquid phase has the advantage of shorter process times due to
 
the accelerated diffusion and also results in near-theoretical densities of the
 
  
Fig. 2.1: Powder-metallurgical manufacturing of composite materials (schematic)
+
During ''sintering without a liquid phase'' (left side of schematic), the powder mix is first densified by pressing, then undergoes a heat treatment (sintering) and eventually is re-pressed again to further increase the density. The sintering atmosphere depends on the material components and later application; a vacuum is used for example for the low gas content material Cu/Cr. This process is used for individual contact parts and also termed press-sinter-repress (PSR). For materials with high silver content, the starting point before pressing is mostly a large block (or billet) which is then, after sintering, hot extruded into wire, rod or strip form. The extrusion further increases the density of these composite materials and contributes to higher arc erosion resistance. Materials such as Ag/Ni, Ag/MeO and Ag/C are typically produced by this process.
T = Melting point of the lower melting component
 
  
composite material. To ensure the shape stability during the sintering process it
+
''Sintering with liquid phase'' has the advantage of shorter process times due to the accelerated diffusion and also results in near-theoretical densities of the composite material. To ensure the shape stability during the sintering process, it
 
is however necessary to limit the volume content of the liquid phase material.
 
is however necessary to limit the volume content of the liquid phase material.
  
As opposed to the liquid phase sintering which has limited use for electrical
+
As opposed to the liquid phase sintering, which has limited use for electrical contact manufacturing, the ''Infiltration process'' as shown on the right side of the schematic, has a broad practical range of applications. In this process the powder of the higher melting component, sometimes also as a powder mix with a small amount of the second material, is pressed into parts. Then, right after sintering, the porous skeleton is infiltrated with liquid metal of the second material. The fill-up process of the pores happens through capillary forces. This process reaches, after the infiltration, near-theoretical density without subsequent pressing and is widely used for Ag- and Cu-refractory contacts. For Ag/W or Ag/WC contacts, controlling the amount or excess on the bottom side of the contact of the infiltration metal Ag, results in contact tips that can be easily attached to their carriers by resistance welding. For larger Cu/W contacts, additional machining is often used to obtain the final shape of the contact component.
contact manufacturing, the Infiltration process as shown on the right side of the
 
schematic has a broad practical range of applications. In this process the
 
powder of the higher melting component sometimes also as a powder mix with
 
a small amount of the second material is pressed into parts and after sintering
 
the porous skeleton is infiltrated with liquid metal of the second material. The
 
filling up of the pores happens through capillary forces. This process reaches
 
after the infiltration near-theoretical density without subsequent pressing and is
 
widely used for Ag- and Cu-refractory contacts. For Ag/W or Ag/WC contacts,
 
controlling the amount or excess on the bottom side of the contact of the
 
infiltration metal Ag results in contact tips that can be easily attached to their
 
carriers by resistance welding. For larger Cu/W contacts additional machining is
 
often used to obtain the final shape of the contact component.
 
 
 
===2.2 Gold Based Materials===
 
 
 
Pure Gold is besides Platinum the chemically most stable of all precious metals.
 
In its pure form it is not very suitable for use as a contact material in
 
electromechanical devices because of its tendency to stick and cold-weld at even
 
low contact forces. In addition it is not hard or strong enough to resist
 
mechanical wear and exhibits high materials losses under electrical arcing
 
loads. This limits its use in form of thin electroplated or vacuum deposited layers.
 
 
 
For most electrical contact applications gold alloys are used. Depending on the
 
alloying metal the melting is performed either under in a reducing atmosphere or
 
in a vacuum. The choice of alloying metals depends on the intended use of the
 
resulting contact material. The binary Au alloys with typically <10 wt% of other
 
precious metals such as Pt, Pd, or Ag or non-precious metals like Ni, Co, and
 
Cu are the more commonly used ones (Table 2.2). On one hand these alloy
 
additions improve the mechanical strength and electrical switching properties
 
but on the other hand reduce the electrical conductivity and chemical corrosion
 
resistance (Fig. 2.2) to varying degrees.
 
 
 
Under the aspect of reducing the gold content ternary alloys with a gold content
 
of approximately 70 wt% and additions of Ag and Cu or Ag and Ni resp., for
 
example AuAg25Cu5 or AuAg20Cu10 are used which exhibit for many
 
applications good mechanical stability while at the same time have sufficient
 
resistance against the formation of corrosion layers (Table 2.3). Other ternary
 
alloys based on the AuAg system are AuAg26Ni3 and AuAg25Pt6. These alloys
 
are mechanically similar to the AuAgCu alloys but have significantly higher
 
oxidation resistance at elevated temperatures (Table 2.4).
 
 
 
Caused by higher gold prices over the past years the development of alloys with
 
further reduced gold content had a high priority. The starting point has been the
 
AuPd system which has continuous solubility of the two components. Besides
 
the binary alloy of AuPd40 and the ternary one AuPd35Ag9 other multiple
 
component alloys were developed. These alloys typically have < 50 wt% Au and
 
often can be solution hardened in order to obtain even higher hardness and
 
tensile strength. They are mostly used in sliding contact applications.
 
 
 
Gold alloys are used in the form of welded wire or profile (also called weldtapes),
 
segments, contact rivets, and stampings produced from clad strip
 
materials. The selection of the bonding process is based on the cost for the
 
joining process, and most importantly on the economical aspect of using the
 
least possible amount of the expensive precious metal component.
 
 
 
Besides being used as switching contacts in relays and pushbuttons, gold
 
alloys are also applied in the design of connectors as well as sliding contacts for
 
potentiometers, sensors, slip rings, and brushes in miniature DC motors
 
(Table 2.5).
 
 
 
Table 2.3: Mechanical Properties of Gold and Gold-Alloys
 
 
 
Table 2.1: Commonly Used Grades of Gold
 
 
 
Table 2.2: Physical Properties of Gold and Gold-Alloys
 
 
 
Fig. 2.2:
 
Influence of 1-10 atomic% of different
 
alloying metals on the electrical resistivity of gold
 
(according to J. O. Linde)
 
 
 
Fig. 2.3:
 
Phase diagram
 
of goldplatinum
 
 
 
Fig. 2.4:
 
Phase diagram
 
of gold-silver
 
 
 
Fig. 2.5:
 
Phase diagram
 
of gold-copper
 
 
 
Fig. 2.6: Phase diagram of gold-nickel
 
 
 
Fig. 2.7: Phase diagram of gold-cobalt
 
 
 
Fig. 2.8:
 
Strain hardening
 
of Au by cold working
 
 
 
Fig. 2.9:
 
Softening of Au after annealing
 
for 0.5 hrs after 80%
 
cold working
 
 
 
Fig. 2.10:
 
Strain hardening of
 
AuPt10 by cold working
 
 
 
Fig. 2.11:
 
Strain hardening
 
of AuAg20 by cold working
 
 
 
Fig. 2.12:
 
Strain hardening of
 
AuAg30 by cold working
 
 
 
Fig. 2.13:
 
Strain hardening of AuNi5
 
by cold working
 
 
 
Fig. 2.14:
 
Softening
 
of AuNi5 after annealing
 
for 0.5 hrs after 80%
 
cold working
 
 
 
Fig. 2.15:
 
Strain hardening
 
of AuCo5 by cold working
 
 
 
Fig. 2.16:
 
Precipitation hardening of
 
AuCo5 at 400°C hardening
 
temperature
 
 
 
Fig. 2.17:
 
Strain hardening
 
of AuAg25Pt6 by cold working
 
 
 
Fig. 2.18:
 
Strain hardening
 
of AuAg26Ni3 by cold working
 
 
 
Fig. 2.19:
 
Softening
 
of AuAg26Ni3 after
 
annealing for 0.5 hrs
 
after 80% cold
 
working
 
 
 
Fig. 2.20:
 
Strain hardening of
 
AuAg25Cu5
 
by cold working
 
 
 
Fig. 2.21:
 
Strain hardening of
 
AuAg20Cu10
 
by cold working
 
 
 
Fig. 2.22:
 
Softening
 
of AuAg20Cu10 after
 
annealing for 0.5 hrs
 
after 80% cold working
 
 
 
Fig. 2.23:
 
Strain hardening of
 
AuCu14Pt9Ag4
 
by cold working
 
 
 
Fig. 2.24:
 
Precipitation
 
hardening of
 
AuCu14Pt9Ag4
 
at different
 
hardening
 
temperatures
 
after 50%
 
cold working
 
 
 
Table 2.4: Contact and Switching Properties of Gold and Gold Alloys
 
  
Table 2.5: Application Examples and Forms of Gold and Gold Alloys
+
==Gold Based Materials==
  
===2.3 Platinum Metal Based Materials===
+
Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form, it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even  low contact forces. In addition, it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads. This limits its use in form of thin electroplated or vacuum deposited layers.
  
The platinum group metals include the elements Pt, Pd, Rh, Ru, Ir, and Os (Table
+
Main Article: [[Gold Based Materials| Gold Based Materials]]
2.6). For electrical contacts platinum and palladium have practical significance
 
as base alloy materials and ruthenium and iridium are used as alloying components.
 
Pt and Pd have similar corrosion resistance as gold but because of their
 
catalytical properties they tend to polymerize adsorbed organic vapors on contact
 
surfaces. During frictional movement between contact surfaces the polymerized
 
compounds known as “brown powder” are formed which can lead to significantly
 
increase in contact resistance. Therefore Pt and Pd are typically used as alloys and
 
not in their pure form for electrical contact applications.
 
  
Rhodium is not used as a solid contact material but is applied for example as a
+
==Platinum Metal Based Materials==
electroplated layer in sliding contact systems. Ruthenium is mostly used as an alloying
 
component in the material PdRu15. The metals osmium and iridium have no practical
 
applications in electrical contacts.
 
  
Since Pd was for the longest time rather stable in price it was looked at as a substitute
+
The platinum group metals include the elements Pt, Pd, Rh, Ru, Ir and Os ([[Platinum_Metal_Based_Materials|Table 1]]<!--(Table 2.6)-->). For electrical contacts, platinum and palladium have practical significance as base alloy materials and ruthenium and iridium are used as alloying components. Pt and Pd have similar corrosion resistance as gold but due to their catalytical properties, they tend to polymerize adsorbed organic vapors on contact surfaces. During frictional movement between contact surfaces, the polymerized compounds known as “brown powder” are formed, which can lead to a significant increase in contact resistance. Therefore Pt and Pd are typically used as alloys and are rather not used in their pure form for electrical contact applications.
for the more expensive gold. This was followed by a steep increase in the Pd price
 
which caused a significant reduction in its use in electrical contacts. Today (2011) the
 
Pd price again is lower than that of gold.
 
  
Alloys of Pt with Ru, Ir, Ni, and W were widely used in electromechanical components
+
Main Article: [[Platinum Metal Based Materials| Platinum Metal Based Materials]]
in the telecommunication industry and in heavy duty automotive breaker points (Table
 
2.7). Today these components have been replaced in many applications by solid
 
state technology and the usage of these materials is greatly reduced. Pd alloys
 
however have a more significant importance. PdCu15 is widely used for example in
 
automotive flasher relays. Because of their resistance to sulfide formation PdAg alloys
 
are applied in various relay designs. The ability to thermally precipitation harden some
 
multi component alloys based on PdAgAuPt they find special usage in wear resistant
 
sliding contact applications. Pd44Ag38Cu15PtAuZn is a standard alloy in this group.
 
  
Platinum and palladium alloys are mainly used similar to the gold based materials in
+
==Silver Based Materials==
the form of welded wire and profile segments but rarely as contact rivets. Because of
 
the high precious metal prices joining technologies are used that allow the most
 
economic application of the contact alloy in the area where functionally needed.
 
Because of their resistance to material transfer they are used for DC applications and
 
due to their higher arc erosion resistance they are applied for medium electrical loads
 
up to about 30W in relays and switches (Table 2.10). Multi-component alloys based
 
on Pd with higher hardness and wear resistance are mainly used as spring arms in
 
sliding contact systems and DC miniature motors.
 
  
Table 2.6: Properties, Production Processes, and Application Forms for Platinum Metals
+
Main Article: [[Silver Based Materials| Silver Based Materials]]
  
Table 2.7: Physical Properties of the Platinum Metals and their Alloys
+
==Tungsten and Molybdenum Based Materials==
  
Table 2.8: Mechanical Properties of the Platinum Metals and their Alloys
+
Main Article: [[Tungsten and Molybdenum Based Materials| Tungsten and Molybdenum Based Materials]]
  
Fig. 2.25:
+
==Contact Materials for Vacuum Switches==
Influence of 1-
 
20 atom% of
 
different additive
 
metals on the
 
electrical
 
resistivity p of
 
platinum
 
(Degussa)
 
  
Fig. 2.26:
+
The low gas content contact materials are developed for the use in vacuum switching devices.  
Influence of 1-22 atom% of different
 
additive metals on the electrical
 
resistivity
 
p of palladium
 
  
Fig. 2.27:
+
Main Article: [[Contact Materials for Vacuum Switches| Contact Materials for Vacuum Switches]]
Phase diagram of
 
platinum-iridium
 
  
Fig. 2.28:
+
==References==
Phase diagram of
 
platinum-nickel
 
  
Fig. 2.29:
+
Vinaricky, E.(Hrsg.): Elektrische Kontakte, Werkstoffe und Anwendungen.
Phase diagram
+
Springer-Verlag, Berlin, Heidelberg etc. 2002
of platinum-tungsten
 
  
Fig. 2.30:
+
Lindmayer, M.: Schaltgeräte-Grundlagen, Aufbau, Wirkungsweise.
Phase diagram of
+
Springer-Verlag, Berlin, Heidelberg, New York, Tokio, 1987
palladium-copper
 
  
Fig. 2.31:
+
Rau, G.: Metallische Verbundwerkstoffe. Werkstofftechnische
Strain
+
Verlagsgesellschaft, Karlsruhe 1977
hardening
 
of Pt by cold
 
working
 
  
Fig. 2.32:
+
Schreiner, H.: Pulvermetallurgie elektrischer Kontakte. Springer-Verlag
Softening of Pt after
+
Berlin, Göttingen, Heidelberg, 1964
annealing for 0.5 hrs
 
after 80%
 
cold working
 
  
Fig. 2.33:
+
Hansen. M.; Anderko, K.: Constitution of Binary Alloys. New York:
Strain hardening of PtIr5
+
Mc Graw-Hill, 1958
by cold working
 
  
Fig. 2.34:
+
Shunk, F.A.: Constitution of Binary Alloy. 2 Suppl. New York; Mc Graw-Hill, 1969
Softening of PtIr5 after annealing for 1 hr
 
after different degrees of cold working
 
  
Fig. 2.35:
+
Edelmetall-Taschenbuch. ( Herausgeber Degussa AG, Frankfurt a. M.),
Strain hardening
+
Heidelberg, Hüthig-Verlag, 1995
of PtNi8 by cold working
 
  
Fig. 2.36:
+
Rau, G.: Elektrische Kontakte-Werkstoffe und Technologie. Eigenverlag G. Rau
Softening of PtNi8 after
+
GmbH & Co., Pforzheim, 1984
annealing
 
for 1 hr after
 
80% cold working
 
  
Fig. 2.37:
+
Heraeus, W. C.: Werkstoffdaten. Eigenverlag W.C. Heraeus, Hanau, 1978
Strain hardening
 
of PtW5 by cold working
 
  
Fig. 2.38:
+
Linde, J.O.: Elektrische Widerstandseigenschaften der verdünnten Legierungen
Softening
+
des Kupfers, Silbers und Goldes. Lund: Hakan Ohlsson, 1938
of PtW5 after
 
annealing for 1hr
 
after 80% cold
 
working
 
  
Fig. 2.39:
+
Engineers Relay Handbook, RSIA, 2006
Strain hardening
 
of Pd 99.99 by cold working
 
  
Fig. 2.40:
+
Großmann, H. Saeger, K. E.; Vinaricky, E.: Gold and Gold Alloys in Electrical
Strain hardening
+
Engineering. in: Gold, Progress in Chemistry, Biochemistry and Technology. John
of PdCu15 by cold working
+
Wiley & Sons, Chichester etc, (1999) 199-236
  
Fig. 2.41:
+
Gehlert, B.: Edelmetall-Legierungen für elektrische Kontakte.
Softening
+
Metall 61 (2007) H. 6, 374-379
of PdCu15 after
 
annealing
 
for 0.5 hrs
 
  
Fig. 2.42:
+
Aldinger, F.; Schnabl, R.: Edelmetallarme Kontakte für kleine Ströme.
Strain hardening
+
Metall 37 (1983) 23-29
of PdCu40 by cold working
 
  
Fig. 2.43:
+
Bischoff, A.; Aldinger, F.: Einfluss geringer Zusätze auf die mechanischen
Softening
+
Eigenschaften von Au-Ag-Pd-Legierungen. Metall 36 (1982) 752-765
of PdCu40
 
after annealing
 
for 0.5 hrs after 80%
 
cold working
 
  
Fig. 2.44:
+
Wise, E.M.: Palladium, Recovery, Properties and Uses. New York, London:
Electrical resistivity p
+
Academic Press 1968
of PdCu alloys with and without an
 
annealing step for forming an ordered
 
phase
 
  
Table 2.9: Contact and Switching Properties
+
Savitskii, E.M.; Polyakova, V.P.; Tylina, M.A.: Palladium Alloys, Primary Sources.
of the Platinum Metals and their Alloys
+
New York: Publishers 1969
  
Table 2.10: Application Examples and Form
+
Gehlert, B.: Lebensdaueruntersuchungen von Edelmetall Kontaktwerkstoff-
of Supply for Platinum Metals and their Alloys
+
Kombinationen für Schleifringübertrager. VDE-Fachbericht 61, (2005) 95-100
  
===2.4 Silver Based Materials===
+
Holzapfel,C.: Verschweiß und elektrische Eigenschaften von
 +
Schleifringübertragern. VDE-Fachbericht 67 (2011) 111-120
  
===2.4.1 Pure Silver===
+
Schnabl, R.; Gehlert, B.: Lebensdauerprüfungen von Edelmetall-
Pure silver (also called fine silver) exhibits the highest electrical and thermal
+
Schleifkontaktwerkstoffen für Gleichstrom Kleinmotoren.
conductivity of all metals. It is also resistant against oxidation. Major disadvantages
+
Feinwerktechnik & Messtechnik (1984) 8, 389-393
are its low mechanical wear resistance, the low softening temperature,
 
and especially its strong affinity to sulfur and sulfur compounds. In the presence
 
of sulfur and sulfur containing compounds brownish to black silver sulfide layer
 
are formed on its surface. These can cause increased contact resistance or
 
even total failure of a switching device if they are not mechanically, electrically,
 
or thermally destroyed. Other weaknesses of silver contacts are the tendency to
 
weld under the influence of over-currents and the low resistance against
 
material transfer when switching DC loads. In humid environments and under
 
the influence of an electrical field silver can creep (silver migration) and cause
 
electrical shorting between adjacent current paths.
 
  
Table 2.11 shows the typically available quality grades of silver. In certain
+
Kobayashi, T.; Koibuchi, K.; Sawa, K.; Endo, K.; Hagino, H.: A Study of Lifetime
economic areas, i.e. China, there are additional grades with varying amounts of
+
of Au-plated Slip-Ring and AgPd Brush System for Power Supply.
impurities available on the market. In powder form silver is used for a wide
+
th Proc. 24 Int. Conf. on Electr. Contacts, Saint Malo, France 2008, 537-542
variety of silver based composite contact materials. Different manufacturing
 
processes result in different grades of Ag powder as shown in Table 2.12.
 
additional properties of silver powders and their usage are described
 
in chapter 8.1.
 
Semi-finished silver materials can easily be warm or cold formed and can be
 
clad to the usual base materials. For attachment of silver to contact carrier
 
materials welding of wire or profile cut-offs and brazing are most widely applied.
 
Besides these mechanical processes such as wire insertion (wire staking) and
 
the riveting (staking) of solid or composite contact rivets are used in the
 
manufacture of contact components.
 
  
Contacts made from fine silver are applied in various electrical switching
+
Harmsen, U.; Saeger K.E.: Über das Entfestigungsverhalten von Silber
devices such as relays, pushbuttons, appliance and control switches for
+
verschiedener Reinheiten. Metall 28 (1974) 683-686
currents < 2 A (Table 2.16). Electroplated silver coatings are widely used to
 
reduce the contact resistance and improve the brazing behavior of other contact
 
materials and components.
 
  
Table 2.11: Overview of the Most Widely Used Silver Grades
+
Behrens, V.; Michal, R.; Minkenberg, J.N.; Saeger, K.E.: Abbrand und
 +
Kontaktwiderstandsverhalten von Kontaktwerkstoffen auf Basis von Silber-
 +
Nickel. e.& i. 107. Jg. (1990), 2, 72-77
  
Table 2.12: Quality Criteria of Differently Manufactured Silver Powders
+
Behrens, V.: Silber/Nickel und Silber/Grafit- zwei Spezialisten auf dem Gebiet
 +
der Kontaktwerkstoffe. Metall 61 (2007) H.6, 380-384
  
Fig. 2.45:
+
Rieder, W.: Silber / Metalloxyd-Werkstoffe für elektrische Kontakte,
Strain hardening
+
VDE - Fachbericht 42 (1991) 65-81
of Ag 99.95 by cold working
 
  
Fig. 2.46:
+
Harmsen,U.: Die innere Oxidation von AgCd-Legierungen unter
Softening of Ag 99.95
+
Sauerstoffdruck.
after annealing for 1 hr after different
+
Metall 25 (1991), H.2, 133-137
degrees of strain hardening
 
  
===2.4.2 Silver Alloys===
+
Muravjeva, E.M.; Povoloskaja, M.D.: Verbundwerkstoffe Silber-Zinkoxid und
To improve the physical and contact properties of fine silver melt-metallurgical
+
Silber-Zinnoxid, hergestellt durch Oxidationsglühen.
produced silver alloys are used (Table 2.13). By adding metal components the
+
Elektrotechnika 3 (1965) 37-39
mechanical properties such as hardness and tensile strength as well as typical
 
contact properties such as erosion resistance, and resistance against material
 
transfer in DC circuits are increased (Table 2.14). On the other hand however,
 
other properties such as electrical conductivity and chemical corrosion
 
resistance can be negatively impacted by alloying (Figs. 2.47 and 2.48).
 
  
===2.4.2.1 Fine-Grain Silver===
+
Behrens, V.; Honig Th.; Kraus, A.; Michal, R.; Saeger, K.-E.; Schmidberger, R.;
Fine-Grain Silver (ARGODUR-Spezial) is defined as a silver alloy with an addition
+
Staneff, Th.: Eine neue Generation von AgSnO<sub>2</sub> -Kontaktwerkstoffen.
of 0.15 wt% of Nickel. Silver and nickel are not soluble in each other in solid
+
VDE-Fachbericht 44, (1993) 99-114
form. In liquid silver only a small amount of nickel is soluble as the phase diagram
 
(Fig. 2.51) illustrates. During solidification of the melt this nickel addition gets
 
finely dispersed in the silver matrix and eliminates the pronounce coarse grain
 
growth after prolonged influence of elevated temperatures (Figs. 2.49 and 2.50.
 
  
Fine-grain silver has almost the same chemical corrosion resistance as fine
+
Braumann, P.; Lang, J.: Kontaktverhalten von Ag-Metalloxiden für den Bereich
silver. Compared to pure silver it exhibits a slightly increased hardness and
+
hoher Ströme. VDE-Fachbericht 42, (1991) 89-94
tensile strength (Table 2.14). The electrical conductivity is just slightly decreased
 
by this low nickel addition. Because of its significantly improved contact
 
properties fine grain silver has replaced pure silver in many applications.
 
  
===2.4.2.2 Hard-Silver Alloys===
+
Hauner, F.; Jeannot, D.; Mc Neilly, U.; Pinard, J.: Advanced AgSnO Contact 2
Using copper as an alloying component increases the mechanical stability of
+
th Materials for High Current Contactors. Proc. 20 Int. Conf. on Electr. Contact
silver significantly. The most important among the binary AgCu alloys is that of
+
Phenom., Stockholm 2000, 193-198
AgCu3, known in europe also under the name of hard-silver. This material still
 
has a chemical corrosion resistance close to that of fine silver. In comparison to
 
pure silver and fine-grain silver AgCu3 exhibits increased mechanical strength
 
as well as higher arc erosion resistance and mechanical wear resistance
 
(Table 2.14).
 
  
Increasing the Cu content further also increases the mechanical strength of
+
Wintz, J.-L.; Hardy, S.; Bourda, C.: Influence on the Electrical Performances of
AgCu alloys and improves arc erosion resistance and resistance against
+
Assembly Process, Supports Materials and Production Means for AgSnO<sub>2</sub> .
material transfer while at the same time however the tendency to oxide formation
+
Proc.24<sub>th</sub> Int. Conf. on Electr. Contacts, Saint Malo, France 2008, 75-81
becomes detrimental. This causes during switching under arcing conditions an
 
increase in contact resistance with rising numbers of operation. In special
 
applications where highest mechanical strength is recommended and a reduced
 
chemical resistance can be tolerated, the eutectic AgCu alloy with 28 wt% of
 
copper (Fig. 2.52) is used. AgCu10 also known as coin silver has been
 
replaced in many applications by composite silver-based materials while sterling
 
silver (AgCu7.5) has never extended its important usage from decorative table
 
wear and jewelry to industrial applications in electrical contacts.
 
  
Besides these binary alloys, ternary AgCuNi alloys are used in electrical contact
+
Behrens, V.; Honig, Th.; Kraus, A.; Michal, R.: Schalteigenschaften von
applications. From this group the material ARGODUR 27, an alloy of 98 wt% Ag
+
verschiedenen Silber-Zinnoxidwerkstoffen in Kfz-Relais. VDE-Fachbericht 51
with a 2 wt% Cu and nickel addition has found practical importance close to that
+
(1997) 51-57
of AgCu3. This material is characterized by high resistance to oxidation and low
 
tendency to re-crystallization during exposure to high temperatures. Besides
 
high mechanical stability this AgCuNi alloy also exhibits a strong resistance
 
against arc erosion. Because of its high resistance against material transfer the
 
alloy AgCu24.5Ni0.5 has been used in the automotive industry for an extended
 
time in the North American market. Caused by miniaturization and the related
 
reduction in available contact forces in relays and switches this material has
 
been replaced widely because of its tendency to oxide formation.
 
  
The attachment methods used for the hard silver materials are mostly close to
+
Schöpf, Th.: Silber/Zinnoxid und andere Silber-Metalloxidwerkstoffe in
those applied for fine silver and fine grain silver.
+
Netzrelais. VDE-Fachbericht 51 (1997) 41-50
  
Hard-silver alloys are widely used for switching applications in the information
+
Schöpf, Th.; Behrens, V.; Honig, Th.; Kraus, A.: Development of Silver Zinc
and energy technology for currents up to 10 A, in special cases also for higher
+
th Oxide for General-Purpose Relays. Proc. 20 Int. Conf. on Electr. Contacts,
current ranges (Table 2.16).
+
Stockholm 2000, 187-192
  
Dispersion hardened alloys of silver with 0.5 wt% MgO and NiO (ARGODUR 32)
+
Braumann, P.; Koffler, A.: Einfluss von Herstellverfahren, Metalloxidgehalt und
are produced by internal oxidation. While the melt-metallurgical alloy is easy to
+
Wirkzusätzen auf das Schaltverhalten von Ag/SnO in Relais. 2
cold-work and form the material becomes very hard and brittle after dispersion
+
VDE-Fachbericht 59, (2003) 133-142
hardening. Compared to fine silver and hard-silver this material has a greatly
 
improved temperature stability and can be exposed to brazing temperatures up
 
to 800°C without decreasing its hardness and tensile strength.
 
Because of these mechanical properties and its high electrical conductivity
 
  
Table 2.13: Physical Properties of Silver and Silver Alloys
+
Kempf, B.; Braumann, P.; Böhm, C.; Fischer-Bühner, J.: Silber-Zinnoxid-
 +
Werkstoffe: Herstellverfahren und Eigenschaften. Metall 61(2007) H. 6, 404-408
  
ARGODUR 32 is mainly used in the form of contact springs that are exposed to
+
Lutz, O.; Behrens, V.; Finkbeiner, M.; Honig, T.; Späth, D.: Ag/CdO-Ersatz in
high thermal and mechanical stresses in relays, and contactors for aeronautic
+
Lichtschaltern. VDE-Fachbericht 61, (2005) 165-173
applications.
 
  
Fig. 2.47:
+
Lutz, O.; Behrens, V.; Wasserbäch, W.; Franz, S.; Honig, Th.; Späth,
Influence of 1-10 atom% of different
+
D.; Heinrich, J.: Improved Silver/Tin Oxide Contact Materials for Automotive
alloying metals on the electrical resistivity of
+
th Applications. Proc.24 Int. Conf. on Electr. Contacts, Saint Malo, France 2008,
silver
+
88-93
  
Fig. 2.48:
+
Leung, C.; Behrens, V.: A Review of Ag/SnO Contact Materials and Arc Erosion. 2
Electrical resistivity p
+
th Proc.24 Int. Conf. on Electr. Contacts, Saint Malo, France 2008, 82-87
of AgCu alloys with 0-20 weight% Cu
 
in the soft annealed
 
and tempered stage
 
a) Annealed and quenched
 
b) Tempered at 280°C
 
  
Fig. 2.49: Coarse grain micro structure
+
Chen, Z.K.; Witter, G.J.: Comparison in Performance for Silver–Tin–Indium
of Ag 99.97 after 80% cold working
+
Oxide Materials Made by Internal Oxidation and Powder Metallurgy.
and 1 hr annealing at 600°C
+
th Proc. 55 IEEE Holm Conf. on Electrical Contacts, Vancouver, BC, Canada,
 +
(2009) 167 – 176
  
Fig. 2.50: Fine grain microstructure
+
Roehberg, J.; Honig, Th.; Witulski, N.; Finkbeiner, M.; Behrens, V.: Performance
of AgNi0.15 after 80% cold working
+
of Different Silver/Tin Oxide Contact Materials for Applications in Low Voltage
and 1 hr annealing at 600°C
+
th Circuit Breakers. Proc. 55 IEEE Holm Conf. on Electrical Contacts, Vancouver,
 +
BC, Canada, (2009) 187 – 194
  
Fig. 2.51:
+
Muetzel, T.; Braumann, P.; Niederreuther, R.: Temperature Rise Behavior of
Phase diagram
+
th Ag/SnO Contact Materials for Contactor Applications. Proc. 55 IEEE Holm 2
of silver-nickel
+
Conf. on Electrical Contacts, Vancouver, BC, Canada, (2009) 200 – 205
  
Fig. 2.52:
+
Lutz, O. et al.: Silber/Zinnoxid – Kontaktwerkstoffe auf Basis der Inneren
Phase diagram
+
Oxidation fuer AC – und DC – Anwendungen.
of silver-copper
+
VDE Fachbericht 65 (2009) 167 – 176
  
Fig. 2.53:
+
Harmsen, U.; Meyer, C.L.: Mechanische Eigenschaften stranggepresster Silber-
Phase diagram of
+
Graphit-Verbundwerkstoffe. Metall 21 (1967), 731-733
silver-cadmium
 
  
Table 2.14: Mechanical Properties of Silver and Silver Alloys
+
Behrens, V.: Mahle, E.; Michal, R.; Saeger, K.E.: An Advanced Silver/Graphite
 +
th Contact Material Based on Graphite Fibre. Proc. 16 Int. Conf. on Electr.
 +
Contacts, Loghborough 1992, 185-189
  
Fig. 2.54:
+
Schröder, K.-H.; Schulz, E.-D.: Über den Einfluss des Herstellungsverfahrens
Strain hardening
+
th auf das Schaltverhalten von Kontaktwerkstoffen der Energietechnik. Proc. 7 Int.
of AgCu3
+
Conf. on Electr. Contacts, Paris 1974, 38-45
by cold working
 
  
Fig. 2.55:
+
Mützel, T.: Niederreuther, R.: Kontaktwerkstoffe für Hochleistungsanwendungen.
Softening of AgCu3
+
VDE-Bericht 67 (2011) 103-110
after annealing for 1 hr
 
after 80% cold working
 
  
Fig. 2.56:
+
Lambert, C.; Cambon, G.: The Influence of Manufacturing Conditions and
Strain hardening of AgCu5 by cold
+
Metalurgical Characteristics on the Electrical Behaviour of Silver-Graphite
working
+
th Contact Materials. Proc. 9 Int. Conf.on Electr. Contacts,
 +
Chicago 1978, 401-406
  
Fig. 2.57:
+
Vinaricky, E.: Grundsätzliche Untersuchungen zum Abbrand- und
Softening of AgCu5 after
+
Schweißverhalten von Ag/C-Kontaktwerkstoffen. VDE-Fachbericht 47 (1995)
annealing for 1 hr after 80% cold
+
159-169
working
 
  
Fig. 2.58:
+
Agte, C.; Vacek, J.: Wolfram und Molybdän. Berlin: Akademie-Verlag 1959
Strain hardening of AgCu 10
 
by cold working
 
  
Fig. 2.59:
+
Keil, A.; Meyer, C.-L.: Der Einfluß des Faserverlaufes auf die elektrische
Softening of AgCu10 after
+
Verschleißfestigkeit von Wolfram-Kontakten. ETZ 72, (1951) 343-346
annealing for 1 hr after 80% cold
 
working
 
  
Fig. 2.60:
+
Slade, P. G.: Electric Contacts for Power Interruption. A Review. Proc. 19 Int.
Strain hardening of AgCu28 by
+
Conf. on Electric Contact Phenom. Nuremberg (Germany) 1998, 239-245
cold working
 
  
Fig. 2.61:
+
Slade, P. G.: Variations in Contact Resistance Resulting from Oxide Formation
Softening of AgCu28
+
and Decomposition in AgW and Ag-WC-C Contacts Passing Steady Currents
after annealing for 1 hr after
+
for Long Time Periods. IEEE Trans. Components, Hybrids and Manuf. Technol.
80% cold working
+
CHMT-9,1 (1986) 3-16
  
Fig. 2.62:
+
Slade, P. G.: Effect of the Electric Arc and the Ambient Air on the Contact
Strain hardening of AgNi0.15
+
Resistance of Silver, Tungsten and Silver-Tungsten Contacts.
by cold working
+
J.Appl.Phys. 47, 8 (1976) 3438-3443
  
Fig. 2.63:
+
Lindmayer, M.; Roth, M.: Contact Resistance and Arc-Erosion of W-Ag and
Softening of AgNi0.15
+
WC-Ag. IEEE Trans components, Hybrids and Manuf. Technol.
after annealing for 1 hr after 80%
+
CHMT-2, 1 (1979) 70-75
cold working
 
  
Fig. 2.64:
+
Leung, C.-H.; Kim, H.J.: A Comparison of Ag/W, Ag/WC and Ag/Mo Electrical
Strain hardening of
+
Contacts. IEEE Trans. Components, Hybrids, Manuf. Technol.,
ARGODUR 27
+
Vol. CHMT-7, 1 (1984) 69-75
by cold working
 
  
Fig. 2.65:
+
Allen, S.E.; Streicher, E.: The Effect of Microstructure on the Electrical
Softening
+
th Performance of Ag-WC-C Contact Materials. Proc. 44 IEEE Holm Conf. on Electr.
of ARGODUR 27 after annealing
+
Contacts, Arlington, VA, USA (1998), 276-285
for 1 hr after 80% cold working
 
  
Table 2.15: Contact and Switching Properties of Silver and Silver Alloys
+
Haufe, W.; Reichel, W.; Schreiner H.: Abbrand verschiedener W/Cu-Sinter-
 +
Tränkwerkstoffe an Luft bei hohen Strömen. Z. Metallkd. 63 (1972) 651-654
  
Table 2.16: Application Examples and Forms of Supply for Silver and Silver Alloys
+
Althaus, B.; Vinaricky, E.: Das Abbrandverhalten verschieden hergestellter
 +
Wolfram-Kupfer-Verbundwerkstoffe im Hochstromlichtbogen.
 +
Metall 22 (1968) 697-701
  
===2.4.2.3 Silver-Palladium Alloys===
+
Gessinger, G.H.; Melton, K.N.: Burn-off Behaviour of WCu Contact Materials in an
The addition of 30 wt% Pd increases the mechanical properties as well as the
+
Electric Arc. Powder Metall. Int. 9 (1977) 67-72
resistance of silver against the influence of sulfur and sulfur containing
 
compounds significantly (Tables 2.17 and 2.18).
 
Alloys with 40-60 wt% Pd have an even higher resistance against silver sulfide
 
formation. At these percentage ranges however the catalytic properties of
 
palladium can influence the contact resistance behavior negatively. The
 
formability also decreases with increasing Pd contents.
 
  
AgPd alloys are hard, arc erosion resistant, and have a lower tendency towards
+
Magnusson, M.: Abbrandverhalten und Rißbildung bei WCu-Tränkwerkstoffen
material transfer under DC loads (Table 2.19). On the other hand the electrical
+
unterschiedlicher Wolframteilchengröße. ETZ-A 98 (1977) 681-683
conductivity is decreased at higher Pd contents. The ternary alloy AgPd30Cu5
 
has an even higher hardness which makes it suitable for use in sliding contact
 
systems.
 
  
AgPd alloys are mostly used in relays for the switching of medium to higher loads
+
Heitzinger, F.; Kippenberg, H.; Saeger, K.E.; Schröder, K.H.: Contact Materials for
(>60V, >2A) as shown in Table 2.20. Because of the high palladium price these
+
Vacuum Switching Devices. Proc. XVth ISDEIV, Darmstadt 1992, 273-278
formerly solid contacts have been widely replaced by multi-layer designs such
 
as AgNi0.15 or AgNi10 with a thin Au surface layer. A broader field of application
 
for AgPd alloys remains in the wear resistant sliding contact systems.
 
  
Fig. 2.66: Phase diagram of silver-palladium
+
Grill, R.; Müller, F.: Verbundwerkstoffe auf Wolframbasis für
 +
Hochspannungsschaltgeräte. Metall 61 (2007) H. 6, 390-393
  
Fig. 2.67:
+
Slade, P.: G.: The Vacuum Interrupter- Theory; Design; and Application. CRC
Strain hardening
+
Press, Boca Raton, FL (USA), 2008
of AgPd30 by cold working
 
  
Fig. 2.68:
+
Frey, P.; Klink, N.; Saeger, K.E.: Untersuchungen zum Abreißstromverhalten von
Strain hardening
+
Kontaktwerkstoffen für Vakuumschütze. Metall 38 (1984) 647-651
of AgPd50 by cold working
 
  
Fig. 2.69:
+
Frey, P.; Klink, N.; Michal, R.; Saeger, K.E.: Metallurgical Aspects of Contact
Strain hardening
+
Materials for Vacuum Switching Devices. IEEE Trans. Plasma Sc. 17, (1989) 743-
of AgPd30Cu5
+
740
by cold working
 
  
Fig. 2.70:
+
Slade, P.: Advances in Material Development for High Power Vacuum Interrupter
Softening of AgPd30, AgPd50,
+
th Contacts. Proc.16 Int. Conf. on Electr. Contact Phenom.,
and AgPd30Cu5 after annealing of 1 hr
+
Loughborough 1992,1-10
after 80% cold working
 
  
Table 2.17: Physical Properties of Silver-Palladium Alloys
+
Behrens, V.; Honig, Th.; Kraus, A.; Allen, S.: Comparison of Different Contact
 +
th Materials for Low Voltage Vacuum Applications. Proc.19 Int. Conf. on Electr.
 +
Contact Phenom., Nuremberg 1998, 247-251
  
Table 2.18: Mechanical Properties of Silver-Palladium Alloys
+
Rolle, S.; Lietz, A.; Amft, D.; Hauner, F.: CuCr Contact Material for Low Voltage
 +
th Vacuum Contactors. Proc. 20 int. Conf. on Electr. Contact. Phenom. Stockholm
 +
2000, 179-186
  
Table 2.19: Contact and Switching Properties of Silver-Palladium Alloys
+
Kippenberg, H.: CrCu as a Contact Material for Vacuum Interrupters.
 +
th Proc.13 Int. Conf. on Electr. Contact Phenom. Lausanne 1986, 140-144
  
Table 2.20: Application Examples and Forms of Suppl for Silver-Palladium Alloys
+
Hauner, F.; Müller, R.; Tiefel, R.: CuCr für Vakuumschaltgeräte-
 +
Herstellungsverfahren, Eigenschaften und Anwendung.
 +
Metall 61 (2007) H. 6, 385-389
  
===2.4.3 Silver Composite Materials===
+
Manufacturing Equipment for Semi-Finished Materials
 +
(Bild)
  
===2.4.3.1 Silver-Nickel (SINIDUR) Materials===
+
[[de:Kontaktwerkstoffe_für_die_Elektrotechnik]]

Latest revision as of 12:54, 26 January 2023

The contact parts are important components in switching devices. They have to maintain their function from the new state until the end of the functional life of the devices.

The requirements on contacts are rather broad. Besides typical contact properties such as

  • High arc erosion resistance
  • High resistance against welding
  • Low contact resistance
  • Good arc moving properties
  • Good arc extinguishing capability

They have to exhibit physical, mechanical and chemical properties like high electrical and thermal conductivity, high hardness, high corrosion resistance etc. and besides this, should have good mechanical workability and also be suitable for good weld and brazing attachment to contact carriers. In addition they must be made from environmentally friendly materials.

Materials suited for use as electrical contacts can be divided into the following groups based on their composition and metallurgical structure:

  • Pure metals
  • Alloys
  • Composite materials


Pure metals

Within this group, silver has the greatest importance for switching devices in the higher energy technology. Other precious metals such as gold and platinum are only used in applications for the information technology in the form of thin surface layers. As a nonprecious metal, tungsten is used for some special applications such as, for example, automotive horn contacts. In some rarer cases, pure copper is used, but mainly paired to a silver-based contact material.

Alloys

Besides these few pure metals, a larger number of alloy materials made by melt technology are available for the use as contacts. An alloy is characterized by the fact, that its components are completely or partially soluble in each other in the solid state. Phase diagrams for multiple metal compositions show the number and type of the crystal structure as a function of the temperature and composition of the alloying components.

They indicate the boundaries of liquid and solid phases and define the parameters of solidification. Alloying allows to improve the properties of one material at the cost of changing them for the second material. As an example, the hardness of a base metal may be increased while at the same time the electrical conductivity decreases with even small additions of the second alloying component.

Composite Materials

Composite materials are a material group whose properties are of great importance for electrical contacts that are used in switching devices for higher electrical currents.

Those used in electrical contacts are heterogeneous materials, composed of two or more uniformly dispersed components, in which the largest volume portion consists of a metal.

The properties of composite materials are determined mainly independent from each other by the properties of their individual components. Therefore it is, for example, possible to combine the high melting point and arc erosion resistance of tungsten with the low melting and good electrical conductivity of copper or the high conductivity of silver with the weld resistant metalloid graphite. Figure 1 shows the schematic manufacturing processes from powder blending to contact material. Three basic process variations are typically applied:

  • Sintering without liquid phase (Press-Sinter-Repress, PSR)
  • Sintering with liquid phase
  • Infiltration (Press-Sinter-Infiltrate, PSI)
Figure 1: Powder-metallurgical manufacturing of composite materials (schematic) Ts = Melting point of the lower melting component)

During sintering without a liquid phase (left side of schematic), the powder mix is first densified by pressing, then undergoes a heat treatment (sintering) and eventually is re-pressed again to further increase the density. The sintering atmosphere depends on the material components and later application; a vacuum is used for example for the low gas content material Cu/Cr. This process is used for individual contact parts and also termed press-sinter-repress (PSR). For materials with high silver content, the starting point before pressing is mostly a large block (or billet) which is then, after sintering, hot extruded into wire, rod or strip form. The extrusion further increases the density of these composite materials and contributes to higher arc erosion resistance. Materials such as Ag/Ni, Ag/MeO and Ag/C are typically produced by this process.

Sintering with liquid phase has the advantage of shorter process times due to the accelerated diffusion and also results in near-theoretical densities of the composite material. To ensure the shape stability during the sintering process, it is however necessary to limit the volume content of the liquid phase material.

As opposed to the liquid phase sintering, which has limited use for electrical contact manufacturing, the Infiltration process as shown on the right side of the schematic, has a broad practical range of applications. In this process the powder of the higher melting component, sometimes also as a powder mix with a small amount of the second material, is pressed into parts. Then, right after sintering, the porous skeleton is infiltrated with liquid metal of the second material. The fill-up process of the pores happens through capillary forces. This process reaches, after the infiltration, near-theoretical density without subsequent pressing and is widely used for Ag- and Cu-refractory contacts. For Ag/W or Ag/WC contacts, controlling the amount or excess on the bottom side of the contact of the infiltration metal Ag, results in contact tips that can be easily attached to their carriers by resistance welding. For larger Cu/W contacts, additional machining is often used to obtain the final shape of the contact component.

Gold Based Materials

Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form, it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition, it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads. This limits its use in form of thin electroplated or vacuum deposited layers.

Main Article: Gold Based Materials

Platinum Metal Based Materials

The platinum group metals include the elements Pt, Pd, Rh, Ru, Ir and Os (Table 1). For electrical contacts, platinum and palladium have practical significance as base alloy materials and ruthenium and iridium are used as alloying components. Pt and Pd have similar corrosion resistance as gold but due to their catalytical properties, they tend to polymerize adsorbed organic vapors on contact surfaces. During frictional movement between contact surfaces, the polymerized compounds known as “brown powder” are formed, which can lead to a significant increase in contact resistance. Therefore Pt and Pd are typically used as alloys and are rather not used in their pure form for electrical contact applications.

Main Article: Platinum Metal Based Materials

Silver Based Materials

Main Article: Silver Based Materials

Tungsten and Molybdenum Based Materials

Main Article: Tungsten and Molybdenum Based Materials

Contact Materials for Vacuum Switches

The low gas content contact materials are developed for the use in vacuum switching devices.

Main Article: Contact Materials for Vacuum Switches

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Engineers Relay Handbook, RSIA, 2006

Großmann, H. Saeger, K. E.; Vinaricky, E.: Gold and Gold Alloys in Electrical Engineering. in: Gold, Progress in Chemistry, Biochemistry and Technology. John Wiley & Sons, Chichester etc, (1999) 199-236

Gehlert, B.: Edelmetall-Legierungen für elektrische Kontakte. Metall 61 (2007) H. 6, 374-379

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Gehlert, B.: Lebensdaueruntersuchungen von Edelmetall Kontaktwerkstoff- Kombinationen für Schleifringübertrager. VDE-Fachbericht 61, (2005) 95-100

Holzapfel,C.: Verschweiß und elektrische Eigenschaften von Schleifringübertragern. VDE-Fachbericht 67 (2011) 111-120

Schnabl, R.; Gehlert, B.: Lebensdauerprüfungen von Edelmetall- Schleifkontaktwerkstoffen für Gleichstrom Kleinmotoren. Feinwerktechnik & Messtechnik (1984) 8, 389-393

Kobayashi, T.; Koibuchi, K.; Sawa, K.; Endo, K.; Hagino, H.: A Study of Lifetime of Au-plated Slip-Ring and AgPd Brush System for Power Supply. th Proc. 24 Int. Conf. on Electr. Contacts, Saint Malo, France 2008, 537-542

Harmsen, U.; Saeger K.E.: Über das Entfestigungsverhalten von Silber verschiedener Reinheiten. Metall 28 (1974) 683-686

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Manufacturing Equipment for Semi-Finished Materials (Bild)