Changes

The contact parts are important components in switching devices. They have tomaintain their function from the new state until the end of the functional life of thedevices.

The requirements on contacts are rather broad. Besides typical contact propertiessuch as

they have to exhibit physical, mechanical, and chemical properties like high electricaland thermal conductivity, high hardness, high corrosion resistance, etc and besidesthis should have good mechanical workability, and also be suitable for good weld andbrazing attachment to contact carriers. In addition they must be made fromenvironmentally friendly materials.

Materials suited for use as electrical contacts can be divided into the following groupsbased on their composition and metallurgical structure:

*'''Pure metals''' From this group silver has the greatest importance for switching devices in the higherenergy technology. Other precious metals such as gold and platinum are only used inapplications for the information technology in the form of thin surface layers. As a nonpreciousmetal tungsten is used for some special applications such as for example asautomotive horn contacts. In some rarer cases pure copper is used but mainly pairedto a silver-based contact material. *'''Alloys'''

Besides these few pure metals a larger number They indicate the boundaries of liquid and solid phases and define the parameters of alloy materials made by meltsolidification.technology are available for Alloying allows to improve the use as contacts. An alloy is characterized by properties of one material at the factthat its components are completely or partially soluble in each other in cost of changing them for the solid statesecond material.Phase diagrams for multiple metal compositions show As an example, the number and type hardness of a base metal may be increased while at thecrystal structure as a function of same time the temperature and composition electrical conductivity decreases with even small additions of the second alloying componentscomponent.

*Composite Materialsmaterials are a material group whose properties are of great importance for electrical contacts that are used in switching devices for higherelectrical currents.

Composite materials are a material group whose properties are of greatimportance for electrical contacts that are used in switching devices for higherelectrical currents.Those used in electrical contacts are heterogeneous materials composed of twoor more uniformly dispersed components in which the largest volume portionconsists of a metal.The properties of composite materials are determined mainly independent fromeach other by the properties of their individual components. Therefore it is forexample possible to combine the high melting point and arc erosion resistanceof tungsten with the low melting and good electrical conductivity of copper, orthe high conductivity of silver with the weld resistant metalloid graphite.

Figure 2The properties of composite materials are determined mainly independent from each other by the properties of their individual components.1 Therefore it is for example possible to combine the high melting point and arc erosion resistance of tungsten with the low melting and good electrical conductivity of copper, or the high conductivity of silver with the weld resistant metalloid graphite. <xr id="fig:Powder metallurgical manufacturing of composite materials (schematic)"/> shows the schematic manufacturing processes from powderblending to contact material. Three basic process variations are typically

During ''sintering without a liquid phase'' <figure id="fig:Powder metallurgical manufacturing of composite materials (left side of schematic) the powder mix is">first densified by pressing, then undergoes a heat treatment [[File:Powder metallurgical manufacturing of composite materials (sinteringschematic), andeventually is re-pressed again to further increase the density. The sinteringatmosphere depends on the material components and later application; avacuum is used for example for the low gas content material Cu/Cr. Thisprocess is used for individual contact parts and also termed pressjpg|thumb|<caption>Powder-sinterrepressmetallurgical manufacturing of composite materials (PSRschematic). For materials with high silver content T_s = Melting point of the starting point atpressing is most a larger block (or billetlower melting component) which is then after sintering hotextruded into wire, rod, or strip form. The extrusion further increases the density</caption>]]of these composite materials and contributes to higher arc erosion resistance.Materials such as Ag</Ni, Ag/MeO, and Ag/C are typically produced by thisprocess.figure>

During ''Sintering with sintering without a liquid phase'' has (left side of schematic) the advantage of shorter process times due powder mix is first densified by pressing, then undergoes a heat treatment (sintering), and eventually is re-pressed again tofurther increase the density. The sintering atmosphere depends on the material components and later application; a vacuum is used for example for the accelerated diffusion low gas content material Cu/Cr. This process is used for individual contact parts and also results in neartermed press-theoretical densities sinterrepress (PSR). For materials with high silver content the starting point at pressing is most a larger block (or billet) which is then after sintering hot extruded into wire, rod, or strip form. The extrusion further increases the density of thethese composite materials and contributes to higher arc erosion resistance. Materials such as Ag/Ni, Ag/MeO, and Ag/C are typically produced by this process.

Fig. 2.1: Powder''Sintering with liquid phase'' has the advantage of shorter process times due to the accelerated diffusion and also results in near-metallurgical manufacturing of composite materials (schematic)T = Melting point theoretical densities of the lower melting component composite material. To ensure the shape stability during the sintering process it

As opposed to the liquid phase sintering which has limited use for electricalcontact manufacturing, the ''Infiltration process'' as shown on the right side of theschematic has a broad practical range of applications. In this process thepowder of the higher melting component sometimes also as a powder mix witha small amount of the second material is pressed into parts and after sinteringthe porous skeleton is infiltrated with liquid metal of the second material. Thefilling up of the pores happens through capillary forces. This process reachesafter the infiltration near-theoretical density without subsequent pressing and iswidely used for Ag- and Cu-refractory contacts. For Ag/W or Ag/WC contacts,controlling the amount or excess on the bottom side of the contact of theinfiltration metal Ag results in contact tips that can be easily attached to theircarriers by resistance welding. For larger Cu/W contacts additional machining isoften used to obtain the final shape of the contact component.

Pure Gold is besides Platinum the chemically most stable of all precious metals.In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resistmechanical wear and exhibits high materials losses under electrical arcingloads. This limits its use in form of thin electroplated or vacuum deposited layers.

Main ArticelArticle: [[Gold Based Materials| Gold Based Materials]]

The platinum group metals include the elements Pt, Pd, Rh, Ru, Ir, and Os ''[[Platinum_Metal_Based_Materials|Table 1]]<!--(Table2.6)''-->. For electrical contacts platinum and palladium have practical significanceas base alloy materials and ruthenium and iridium are used as alloying components.Pt and Pd have similar corrosion resistance as gold but because of theircatalytical properties they tend to polymerize adsorbed organic vapors on contactsurfaces. During frictional movement between contact surfaces the polymerizedcompounds known as “brown powder” are formed which can lead to significantlyincrease in contact resistance. Therefore Pt and Pd are typically used as alloys andnot in their pure form for electrical contact applications.

Main ArticelArticle: [[Platinum Metal Based Materials| Platinum Metal Based Materials]]

Tungsten and Molybdenum (Pure Metals), Silver–Tungsten (SIWODUR) Materials, Silver–Tungsten Carbide (SIWODUR C) Materials, Silver–Molybdenum (SILMODUR) Materials, Copper–Tungsten (CUWODUR) Materials Main ArticelArticle: [[Tungsten and Molybdenum Based Materials| Tungsten and Molybdenum Based Materials]] ===Tungsten and Molybdenum (Pure Metals)===Tungsten is characterized by its advantageous properties of high melting andboiling points, sufficient electrical and thermal conductivity and high hardnessand density ''(Table 2.35)''. It is mainly used in the form of brazed contact tips forswitching duties that require a rapid switching sequence such as horn contactsfor cars and trucks. Molybdenum has a much lesser importance as a contact material since it is lessresistant against oxidation than tungsten.Both metals are however used in large amounts as components in compositematerials with silver and copper. Table 2.35: Mechanical Properties of Tungsten and Molybdenum === Silver–Tungsten (SIWODUR) Materials===Ag/W (SIWODUR) contact materials combine the high electrical and thermalconductivity of silver with the high arc erosion resistance of the high meltingtungsten metal ''(Table 2.36)''. The manufacturing of materials with typically50-80 wt% tungsten is performed by the powder metallurgical processes ofliquid phase sintering or by infiltration. Particle size and shape of the startingpowders are determining the micro structure and the contact specific propertiesof this material group ''(Figs. 2.134 and 2.135) (Table 2.37)''. During repeated switching under arcing loads tungsten oxides and mixedoxides (silver tungstates – Ag₂ WO₄ ) are formed on the Ag/W surface creating 2 4poorly conducting layers which increase the contact resistance and by this thetemperature rise during current carrying. Because of this fact the Ag/W is pairedin many applications with Ag/C contact parts. Silver–tungsten contact tips are used in a variety of shapes and are produced forthe ease of attachment with a fine silver backing layer and quite often anadditional thin layer of a brazing alloy. The attachment to contact carriers isusually done by brazing, but also by direct resistance welding for smaller tips. Ag/W materials are mostly used as the arcing contacts in disconnect switchesfor higher loads and as the main contacts in small and medium duty powerswitches and industrial circuit breakers ''(Table 2.38)''. In north and south americathey are also used in large volumes in miniature circuit breakers of small tomedium current ratings in domestic wiring as well as for commercial powerdistribution. === Silver–Tungsten Carbide (SIWODUR C) Materials===This group of contact materials contains the typically 40-65 wt-% of the veryhard and erosion wear resistant tungsten carbide and the high conductivity silver''(Fig. 2.135) (Table 2.36)''. Compared to Ag/W the Ag/WC (SIWODUR C)materials exhibit a higher resistance against contact welding ''(Table 2.37)''. Therise in contact resistance experienced with Ag/W is less pronounced in Ag/WCbecause during arcing a protective gas layer of CO is formed which limits thereaction of oxygen on the contact surface and therefore the formation of metaloxides. Higher requirements on low temperature rise can be fulfilled by adding a smallamount of graphite which however increases the arc erosion. Silver–tungstencarbide–graphite materials with for example 27 wt% WC and3 wt% graphite or 16 wt% WC and 2 wt% graphite are manufactured using thesingle tip press-sinter-repress (PSR) process ''(Fig. 2.136)''. The applications of Ag/WC contacts are similar to those for Ag/W ''(Table 2.38)''. === Silver–Molybdenum (SILMODUR) Materials===Ag/Mo materials with typically 50-70 wt% molybdenum are usually produced bythe powder metallurgical infiltration process ''(Fig. 2.137) (Table 2.36)''. Theircontact properties are similar to those of Ag/W materials ''(Table 2.37)''. Since themolybdenum oxide is thermally less stable than tungsten oxide the self-cleaningeffect of Ag/Mo contact surface during arcing is more pronounced and thecontact resistance remains lower than that of Ag/W. The arc erosion resistanceof Ag/Mo however is lower than the one for Ag/W materials. The mainapplications for Ag/Mo contacts are in equipment protecting switching devices''(Table 2.38)''. Fig. 2.134: Micro structure of Ag/W 25/75 Fig. 2.135: Micro structure of Ag/WC 50/50 Fig. 2.136: Micro structure of Ag/WC27/C3 Fig. 2.137: Micro structure of Ag/Mo 35/65 Table 2.36: Physical Properties of Contact Materials Based on Silver–Tungsten (SIWODUR),Silver–Tungsten Carbide (SIWODUR C) and Silver Molybdenum (SILMODUR) Table 2.37: Contact and Switching Properties of Contact Materials Based on Silver – Tungsten(SIWODUR), Silver–Tungsten Carbide (SIWODUR C)and Silver Molybdenum (SILMODUR) Table 2.38: Application Examples and Forms of Supply for Contact Materials Basedon Silver–Tungsten (SIWODUR), Silver–Tungsten Carbide (SIWODUR C)and Silver Molybdenum (SILMODUR) ==== Copper–Tungsten (CUWODUR) Materials====Copper–tungsten (CUWODUR) materials with typically 50-85 wt% tungsten areproduced by the infiltration process with the tungsten particle size selectedaccording to the end application ''(Figs. 2.138 – 2.141) (Table 2.39)''. To increasethe wettability of the tungsten skeleton by copper a small amount of nickel< 1 wt% is added to the starting powder mix. W/Cu materials exhibit a very high arc erosion resistance ''(Table 2.40)''.Compared to silver–tungsten materials they are however less suitable to carrypermanent current. With a solid tungsten skeleton as it is the case for W/C infiltrated materials with70-85 wt% tungsten the lower melting component copper melts and vaporizesin the intense electrical arc. At the boiling point of copper (2567°C) the still solidtungsten is efficiently “cooled” and remains pretty much unchanged. During very high thermal stress on the W/Cu contacts, for example during shortcircuit currents > 40 kA the tungsten skeleton requires special high mechanicalstrength. For such applications a high temperature sintering of tungsten fromselected particle size powder is applied before the usual infiltration with copper(example: CUWODUR H). For high voltage load switches the most advantageous contact system consistsof a contact tulip and a contact rod. Both contact assemblies are made usuallyfrom the mechanically strong and high conductive CuCrZr material and W/Cu asthe arcing tips. The thermally and mechanically highly stressed attachmentbetween the two components is often achieved by utilizing electron beamwelding or capacitor discharge percussion welding. Other attachment methodsinclude brazing and cast-on of copper followed by cold forming steps toincrease hardness and strength. The main application areas for CUWODUR materials are as arcing contacts inload and high power switching in medium and high voltage switchgear as wellas electrodes for spark gaps and over voltage arresters ''(Table 2.41)''. Table 2.39: Physical Properties of Copper–Tungsten (CUWODUR) Contact Materials Fig. 2.139: Micro structure of W/Cu 70/30 G Fig. 2.140: Micro structure of W/Cu 70/30 H Fig. 2.138: Micro structure of W/Cu 70/30 F Fig. 2.141: Micro structure of W/Cu 80/20 H Manufacturing of Contact Parts forMedium and High Voltage Switchgear Table 2.40: Contact and Switching Properties of Copper–Tungsten(CUWODUR) Contact Materials Table 2.41: Application Examples and Forms of Supply for Tungsten–Copper (CUWODUR) Contact Materials

Fig. 2.145: Micro structure The trade name VAKURIT is assigned to a family of Cu/Cr 50/50– low gascontent contact materials developed for the use in vacuum switching devices [[Special_Contact_Materials_(VAKURIT)_for_Vacuum_Switches|Table 1]]

Table 2.43Main Article: [[Special Contact and Switching Properties of Materials (VAKURIT ) for Vacuum Switches| Special Contact Materials Table 2.44: Application Examples and Form of Supply (VAKURIT) for VAKURIT MaterialsVacuum Switches]]