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Contact Carrier Materials

18 bytes added, 15:45, 24 January 2014
5.1.2 Pure Copper
<th><p class="s3">Material</p></th><th><p class="s3">Condition</p></th><th><p class="s3">Tensile Strength</p><p class="s3">R<span class="s11">m</span></p><p class="s3">[MPa]</p></th><th><p class="s3">0,2% Yield</p><p class="s3">Strength R<span class="s11">p0,2</span></p><p class="s3">[MPa]</p></th><th><p class="s3">Elongation</p><p class="s3">A<span class="s11">50</span></p><p class="s3">[ %]</p></th><th><p class="s3">Hardness</p><p class="s3">HV</p></th>
</tr><tr>
<td class="multirow" rowspan="4">Cu-ETP <br> Cu-OF <br> Cu-HCP <br>Cu-DLP <br> Cu-DHP</td>
<td>R220</td><td>220 - 260</td>
<td>&lt;140</td><td>&gt;33</td><td>40 - 65</td>

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