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→5.1.3 High Cu Content Copper Alloys
The materials CuFe0.1 and CuSn0.15 have a high electrical conductivity. The mechanical strength of both is relatively low but stays almost constant at temperatures up to 400°C. The are used as substrates for power semiconductors and also as carriers for stationary contacts in higher energy
switchgear.
CuFe2 is a material exhibiting high electrical conductivity and good formability. During an annealing process Fe-rich precipitations are formed in the " -Cu matrix which change the mechanical properties very little but increase the electrical conductivity significantly. Besides being used as a contact carrier material in switching devices, this material has broader applications in automotive connectors and as a substrate in the semiconductor technology.
CuNi2Si has high mechanical strength, good formability, and at the same time high electrical conductivity. This combination of advantageous properties is achieved by a defined finely dispersed precipitation of nickel silicides. CuNi2Si is used mainly in the form of stamped and formed parts in thermally stressed electromechanical components for automotive applications.
CuSn1CrNiTi and CuCrSiTi are advanced developments of the Cu-Cr-Ti precipitation materials with fine intermetallic dispersions. The material
CuNi1Co1Si also belongs into this family and has properties similar to the low alloyed CuBe materials.
Tab. 5.5 Physical Properties of Selected High Cu Content Copper Alloys (2 teile!)
Table 5.6; Mechanical Properties of Selected High Cu Content Copper Alloys (2 teile!)
