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Contact Carrier Materials

124 bytes removed, 12:54, 5 March 2014
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Copper and copper alloys to be used in electrical and electronic components are usually covered by national and international standards. DIN numbers the
materials by a prefix and/or a material number. The newer European standards (EN) refer to the material's usage products and also show a prefix and material number. For reference we also show in <xr id="tab:tab5.1MaterialDesignations"/> the material designation according to UNS, the Unified Numbering System (USA). Other internationally used standard and material numbers include, among others, those issued by CDA (Copper Development Association, USA), and GB (Guo Biao – China).
The most important EN as well as the US based and widely used ASTM standards covering the use of flat rolled copper and copper alloys in electrical contacts are:
Cu-HCP, Cu-DLP, and Cu-DHP are oxygen free copper types de-oxidized with different phosphorus contents. With increasing phosphorus content the
electrical conductivity decreases. Cu-OFE, also called OFHC copper, is free of oxygen and also free of de-oxidizing compounds.
 
 
<figtable id="tab:MaterialDesignations">
{|+ <caption> Material Designations of Some Copper Types</caption>
|ASTM B 534-07 || Sec. for CuCoBe-Alloy and CuNiBe-Alloy Plate, Sheet, Strip, and Rolled Bar
|}
</figtable>
 
<figtable id="tab:tab5.1">
'''Table 5.1: Material Designations of Some Copper Types'''
<table class="twocolortable" border="1" cellspacing="0" style="border-collapse:collapse">
<caption> Material Designations of Some Copper Types</caption>
<tr>
<th>WerkstMaterialEN-Designation</th><th>EN-Number</th><th>DIN-Designation</th><th>DIN-Number</th><th>UNS</th></tr>

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