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contact material. The selection of the most suitable carrier material also plays
an important role.
The most frequently used ones are copper based materials. Depending on the
application also materials based on nickel or multi-layer composite materials,
====5.11 Standards Overview====
Copper and copper alloys to be used in electrical and electronic components
are usually covered by national and international standards. DIN numbers the
materials by a prefix and/or a material number. The newer European standards
used standard and material numbers include, among others, those issued by
CDA (Copper Development Association, USA), and GB (Guo Biao – China).
The most important EN as well as the US based and widely used ASTM
standards covering the use of flat rolled copper and copper alloys in electrical
be reversed easily by subsequent annealing. The softening properties are
strongly dependent on the preceding cold working percentage
''(Figs. 5.2 and 5.3)''.
The purity of technically pure and un-alloyed copper used for electrical
applications depends on the type used and ranges between > 99.90 and 99.95
wt%. The copper types are designated mainly by their oxygen content as
oxygen containing, oxygen-free, and de-oxidized with phosphorus as
described in DIN EN 1652 ''(Tables 5.1 and 5.2)''.Tables 5.3. and 5.4 show the
physical and mechanical properties of these copper materials. According to
these, Cu-ETP, Cu-OFE, and Cu-HCP are the types of copper for which
5.1.2 Pure Copper
Table 5.1: Material Designations of Some Copper Types
[[File:Strain_hardering.png|left|Fig 5.1: Strain_hardening of Cu-ETP by cold working]]
