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====<!--5.1.7.5 -->Relaxation Behavior====
Tension relaxation is defined as the loss of tension of an elastically stressed material as a function of time and temperature. The causes for the relaxation are thermally activated processes which are comparable to creep behavior. As a measure for the relaxation the percentage decrease in the bending tension compared to the initial one is used. Temperature increase is a stronger influencing factor on the relaxation of the spring force than growing operational times. Through suitable annealing processes the relaxation degree can be significantly reduces.
For the measurement of tension relaxation different test procedures are used, based on the ASTM E-32-86.
<xr id="fig:Relaxation behavior of selected copper based materials"/> <!--Fig. 5.44 --> illustrates the different relaxation behavior of some copper alloys. Good behavior is shown for CuNi3Si1Mg and CuCrSiTi while CuZn30 and CuSn6 exhibit a less favorable relaxation tendency.
<figure id="fig:Relaxation behavior of selected copper based materials">
==References==
[[Contact Carrier Materials#References|References]]
[[de:Kenngrößen_zur_Bewertung_der_Eigenschaften_von_Kupfer-Legierungen]]
