Data Book of Electrical Contacts

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Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
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Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Featured Files

Ultrasound print-out of braze joints.jpg
Ultrasound print-out of braze joints between Ag/SnO 88/12 tips and Cu carrier with 2 different degree of wetting (dark areas = voids)
Pages: Evaluation of Braze or Weld Joints,
Prüfung von Löt- und Schweißverbindungen

by Doduco Redaktion


Strain hardening of oxidized AgSnO2 88 12 PW4.jpg
Strain hardening of oxidized Ag/SnO2 88/12 PW4 by cold working
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion