Data Book of Electrical Contacts

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Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
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Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Featured Files

Physical Properties of-Contact Materials Based.jpg
Reverted to version as of 12:18, 17 December 2013

by Doduco Admin


Fine grain microstructure of AgNiO.jpg
Fine grain microstructure of AgNi0.15 after 80% cold working and 1 hr annealing at 600°C
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion