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From Electrical Contacts
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Micro structure of Ag/SnO2 88/12 TOS F: a) perpendicular to extrusion direction b) parallel to extrusion direction
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis
by Doduco Redaktion
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis
by Doduco Redaktion
Softening of Cu-ETP after annealing for 3hrs after 25% cold working
Pages: Contact Carrier Materials,
Trägerwerkstoffe
by Doduco Redaktion
Pages: Contact Carrier Materials,
Trägerwerkstoffe
by Doduco Redaktion