Difference between revisions of "Wiki der elektrischen Kontakte"

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Revision as of 16:36, 26 September 2014

Willkommen in der neuen Wiki der elektrischen Kontakte

Die Grundlage dieser Wiki ist die 2012er Ausgabe des "DODUCO Datenbuch der elektrischen Kontakte", welches auch in gedruckter Form erhältlich ist.
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Für weitere Fragen oder Hilfe kontaktieren Sie uns bitte direkt unter DODUCO Kontakt


Zufälliger Artikel

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Zufällige Dateien

Electrical conductivity and hardness of precipitation hardened CuCr 0.6.jpg
Electrical conductivity and hardness of precipitation hardened CuCr 0.6 after cold working
Pages: Precipitation Hardening Copper Alloys,
Aushärtbare Kupfer-Legierungen

by Doduco Redaktion


Softening of AgPd30 AgPd50 AgPd30Cu5.jpg
Softening of AgPd30, AgPd50, and AgPd30Cu5 after annealing of 1 hr after 80% cold working
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion