Data Book of Electrical Contacts

Welcome to our Wiki of electrical contacts The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form. To get your desired information, please use: Table of Contents Contact Wiki Guide Search Window For further questions or help, please contact us directly under Contact DODUCO Featured Article Applications for Bonding Technologies Wire Bonding Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Featured Files Strain hardening of internally oxidized Ag SnO2 88 12 TOS F.jpg Strain hardening of internally oxidized Ag/SnO2 88/12 TOS F by cold working Pages: Silver Based Materials, Werkstoffe auf Silber-Basis by Doduco Redaktion Micro structure of Ag C 96 4 D.jpg Micro structure of Ag/C 96/4 D: a) perpendicular to extrusion direction b) parallel to extrusion direction, 1) Ag/C contact layer, 2) Ag backing layer Pages: Silver Based Materials, Werkstoffe auf Silber-Basis by Doduco Redaktion