Difference between revisions of "Template:MainPicture"

Latest revision as of 12:43, 6 May 2014

Copper corner of the copper chromium phase diagram.jpg

Copper corner of the copper-chromium phase diagram for up to 0.8 wt% chromium
Pages: Precipitation Hardening Copper Alloys,
Aushärtbare Kupfer-Legierungen
by Doduco Redaktion

Micro structure of Ag C 95 5.jpg

Micro structure of Ag/C 95/5: a) perpendicular to extrusion direction b) parallel to extrusion direction, 1) Ag/C contact layer, 2) Ag backing layer
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis
by Doduco Redaktion

@@ Line 1: / Line 1: @@
 <div class="picture-item">
-<div class="picture-item-src">
+<rimage size="170px" float="left" info="1" />
-<randomimage size="170px" float="left" choices="SofteningOfCuETPafterAnnealing.png|Strain_hardering.png" /></div>
-<div class="picture-item-text"> Different shapes of silver powders <br>
+</div>
-at:  [[Carrier Materials]] by [[Musteruser]]
+<div style="clear:both"></div>
-Categories: [[Metal Powders]], [[Metal Firing Preparations]]</div></div><br>
 <div class="picture-item">
+<rimage size="170px" float="left" info="1" />
-<div class="picture-item-src">
+</div>
-<randomimage size="170px" float="left" choices="Typical configurations of multi-layer contact profiles.jpg|Correlation between Contact Joining Methods and Switching Currents.jpg"/></div>
-<div class="picture-item-text"> Correlation between Contact Joining Methods and Switching Currents<br>
-at:  [[Carrier Materials]] by [[Musteruser]]
-Categories: [[Metal Powders]], [[Metal Firing Preparations]]</div></div><br>