Difference between revisions of "Other Naturally Hard Copper Alloys"
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| − | ==== | + | ====5.1.5.1 Copper-Nickel Alloys==== |
| − | Copper and nickel are in their solid and liquid phase completely soluble in each other | + | Copper and nickel are in their solid and liquid phase completely soluble in each other <xr id="fig:Phase diagram of copper-nickel for the range of 0 – 50 wt% nickel"/> (Fig. 5.21). Because of their very low electrical conductivity they are mainly used as resistance alloys <xr id="fig:Electrical conductivity of copper-nickel alloys as a function of nickel content"/> (Fig. 5.22). The work hardening and softening behavior of CuNi alloys and CuNi9Sn2 are shown in [[#figures6|(Figs. 3 – 7)]] Figs. 5.23 – 5.27. Coppernickel alloys exhibit high corrosion resistance, good weldabilty, and the suitability for cladding to other materials. Because of these and their other properties (Tables 5.15 and 5.16) they are, with and without additives of iron or manganese, widely used as good weldable backing layers on weld buttons and weld profiles (weld tapes). |
| − | ==== | + | ====5.1.5.2 Copper-Nickel-Tin Alloys==== |
| − | Copper-Nickel- multi component alloys with 9 wt% Ni and 2 wt% Sn are used mainly as connector materials because of their suitable mechanical properties, their excellent relaxation behavior and their high corrosion resistance. Other advantages include their high temperature stability and the good solderability | + | Copper-Nickel- multi component alloys with 9 wt% Ni and 2 wt% Sn are used mainly as connector materials because of their suitable mechanical properties, their excellent relaxation behavior, and their high corrosion resistance. Other advantages include their high temperature stability and the good solderability even after longer storage. They are also used as base materials for clad profiles and tapes. |
| − | < | + | <figure id="fig:Phase diagram of copper-nickel for the range of 0 – 50 wt% nickel"> |
| + | Fig. 5.21: Phase diagram of copper-nickel for the range of 0 – 50 wt% nickel | ||
| + | [[File:Phase diagram of copper nickel.jpg|right|thumb|Phase diagram of copper-nickel for the range of 0 – 50 wt% nickel]] | ||
| + | </figure> | ||
| − | <figure id="fig: | + | <figure id="fig:Electrical conductivity of copper-nickel alloys as a function of nickel content"> |
| − | [[File: | + | Fig. 5.22: Electrical conductivity of copper-nickel alloys as a function of nickel content |
| + | [[File:Electrical conductivity of copper nickel alloys.jpg|right|thumb|Electrical conductivity of copper-nickel alloys as a function of nickel content]] | ||
</figure> | </figure> | ||
| − | + | '''Table 5.15: Physical Properties of Selected Copper-Nickel Alloys''' | |
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| − | + | 2 Teile! | |
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| − | + | '''Table 5.16: Mechanical Properties of Selected Copper-Nickel Alloys''' | |
| + | 2 Teile! | ||
| − | < | + | <xr id="fig:Strain hardening of copper-nickel alloys as a function of nickel content"/> Fig. 5.23: Strain hardening of copper-nickel alloys as a function of nickel content |
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| − | + | <xr id="fig:Strain hardening of CuNi25 by cold working"/> Fig. 5.24: Strain hardening of CuNi25 by cold working | |
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| − | + | <xr id="fig:Softening of CuNi25 after 1 hr annealing after 50% cold working"/> Fig. 5.25: Softening of CuNi25 after 1 hr annealing after 50% cold working | |
| − | < | + | <xr id="fig:Strain hardening of CuNi9Sn2 by cold working (Wieland)"/> Fig. 5.26: Strain hardening of CuNi9Sn2 by cold working (Wieland) |
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| − | + | <xr id="fig:Softening of CuNi9Sn2 after 1 hr annealing after 60% cold working (Wieland)"/> Fig. 5.27: Softening of CuNi9Sn2 after 1 hr annealing after 60% cold working (Wieland) | |
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| − | <div | + | <div class="multiple-images"> |
<figure id="fig:Strain hardening of copper-nickel alloys as a function of nickel content"> | <figure id="fig:Strain hardening of copper-nickel alloys as a function of nickel content"> | ||
| − | [[File:Strain hardening of copper nickel alloys as function.jpg|left|thumb|<caption>Strain hardening of copper-nickel alloys as a function of nickel content | + | [[File:Strain hardening of copper nickel alloys as function.jpg|left|thumb|<caption>Strain hardening of copper-nickel alloys as a function of nickel content]] |
</figure> | </figure> | ||
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==References== | ==References== | ||
[[Contact Carrier Materials#References|References]] | [[Contact Carrier Materials#References|References]] | ||
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Revision as of 17:45, 5 March 2014
5.1.5.1 Copper-Nickel Alloys
Copper and nickel are in their solid and liquid phase completely soluble in each other Figure 1 (Fig. 5.21). Because of their very low electrical conductivity they are mainly used as resistance alloys Figure 2 (Fig. 5.22). The work hardening and softening behavior of CuNi alloys and CuNi9Sn2 are shown in (Figs. 3 – 7) Figs. 5.23 – 5.27. Coppernickel alloys exhibit high corrosion resistance, good weldabilty, and the suitability for cladding to other materials. Because of these and their other properties (Tables 5.15 and 5.16) they are, with and without additives of iron or manganese, widely used as good weldable backing layers on weld buttons and weld profiles (weld tapes).
5.1.5.2 Copper-Nickel-Tin Alloys
Copper-Nickel- multi component alloys with 9 wt% Ni and 2 wt% Sn are used mainly as connector materials because of their suitable mechanical properties, their excellent relaxation behavior, and their high corrosion resistance. Other advantages include their high temperature stability and the good solderability even after longer storage. They are also used as base materials for clad profiles and tapes.
Fig. 5.21: Phase diagram of copper-nickel for the range of 0 – 50 wt% nickel
Fig. 5.22: Electrical conductivity of copper-nickel alloys as a function of nickel content
Table 5.15: Physical Properties of Selected Copper-Nickel Alloys
2 Teile!
Table 5.16: Mechanical Properties of Selected Copper-Nickel Alloys
2 Teile!
Figure 3 Fig. 5.23: Strain hardening of copper-nickel alloys as a function of nickel content
Figure 4 Fig. 5.24: Strain hardening of CuNi25 by cold working
Figure 5 Fig. 5.25: Softening of CuNi25 after 1 hr annealing after 50% cold working
Figure 6 Fig. 5.26: Strain hardening of CuNi9Sn2 by cold working (Wieland)
Figure 7 Fig. 5.27: Softening of CuNi9Sn2 after 1 hr annealing after 60% cold working (Wieland)
