Difference between revisions of "Data Book of Electrical Contacts"

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Revision as of 17:47, 27 January 2014

Featured Article

Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
To get your desired information, please use:

For further questions or help, please contact us directly under Contact DODUCO


Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Featured Files

Micro structure of Ag C 96 4 D.jpg
Micro structure of Ag/C 96/4 D: a) perpendicular to extrusion direction b) parallel to extrusion direction, 1) Ag/C contact layer, 2) Ag backing layer
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion


Strain hardening of oxidized AgSnO2 88 12 PW4.jpg
Strain hardening of oxidized Ag/SnO2 88/12 PW4 by cold working
Pages: Silver Based Materials,
Werkstoffe auf Silber-Basis

by Doduco Redaktion

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