Data Book of Electrical Contacts

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Welcome to our Wiki of electrical contacts

The basis of this Wiki is the 2012 issue of the "DODUCO Data Book of Electrical Contacts" which is also available in printed form.
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Featured Article

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle this process consists of pressure welding with the aid of ultrasound. The metallurgical bond is mainly caused by frictional heat created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and un...

Featured Files

Micro structure of AgNi9010.jpg
Micro structure of Ag/Ni 90/10 a) perpendicular to the extrusion direction b) parallel to the extrusion direction
Pages: Werkstoffe auf Silber-Basis,
Silver Based Materials

by Doduco Redaktion

Electrical conductivity and hardness of precipitation hardened CuCr 0.6.jpg
Electrical conductivity and hardness of precipitation hardened CuCr 0.6 after cold working
Pages: Precipitation Hardening Copper Alloys,
Aushärtbare Kupfer-Legierungen

by Doduco Redaktion