Difference between revisions of "Template:MainPicture"

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<randomimage size="170px" float="left" choices="Typical configurations of multi-layer contact profiles.jpg|Correlation between Contact Joining Methods and Switching Currents.jpg"/></div>
 
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<div class="picture-item-text"> Correlation between Contact Joining Methods and Switching Currents<br>
 
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at:  [[Carrier Materials]] by [[Musteruser]]
 
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Categories: [[Metal Powders]], [[Metal Firing Preparations]]</div></div><br>
 

Latest revision as of 13:43, 6 May 2014

Commonly Used Grades of Gold.jpg
Commonly Used Grades of Gold

by Doduco Redaktion


Micro structure of Ag W 25 75.jpg
Micro structure of Ag/W 25/75
Pages: Tungsten and Molybdenum Based Materials,
Werkstoffe auf Wolfram- und Molybdän-Basis
by Doduco Redaktion
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