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518 bytes added, 16:18, 12 May 2014
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<div class="accordion-header"><span class="dotted">[[#|PDV]]</span></div>
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The term PVD (physical vapor deposition) defines processes of metal, metal alloys, and chemical compounds deposition in a vacuum by adding thermal and kinetic energy through particle bombardment. The main processes are the following four coating variations:
 
Vapor deposition
Sputtering (Cathode atomization)
Arc vaporizing
Ion implantation
 
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm)
[[Surface_Coating_Technologies#7.2_Coatings_from_the_Gaseous_Phase_.28Vacuum_Deposition.29|more]]
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