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[[Electroplating_(or_Galvanic_Deposition)|more]] </div>
<div class="accordion-header"><span class="dotted">[[#|PDVPVD]]</span></div>
<div>The term PVD (physical vapor deposition) defines processes of metal, metal alloys, and chemical compounds deposition in a vacuum by adding thermal and kinetic energy through particle bombardment. The main processes are the following four coating variations:
* Vapor deposition* Sputtering (Cathode atomization)* Arc vaporizing* Ion implantation
In all four processes the coating material is transported in its atomic form to the substrate and deposited on it as a thin layer (a few nm to approx. 10 μm)
[[Surface_Coating_Technologies#7.2_Coatings_from_the_Gaseous_Phase_.28Vacuum_Deposition.29|more]]