Changes

For many applications thicker precious metal surfaces or AlSi layers are necessary. These cannot be deposited by electroplating. Besides meltmetallurgically produced materials on the basis of gold, palladium and silver, also powder-metallurgical materials are required frequently. The metallurgical bond between these contact materials and the mostly copper based substrates is achieved through various mechanical cladding methods (see also chapter 3.2.1[[Manufacturing of Semi-Finished Materials#Clad Semi-Finished Pre-Materials (Contact-Bimetals)| Clad Semi-Finished Pre-Materials (Contact-Bimetals)]]). In this way also aluminum clad strips are manufactured in which the aluminum layer serves as the bondable surface in the interface between electromechanical connections and electronic circuits. These clad semifinished materials can be further fabricated into pre-stamped strips, in comb form, or single stamped parts <xr id="fig:Examples of clad stamped parts"/> (Fig. 3.18).