2,808
edits
Changes
→7.1.1.1.2 Non-Precious Metal Electrolytes
*Tin electrolytes < br/>Pure tin and tin alloy deposits are used as dull or also bright surface layers on surfaces required for soldering. In the printed circuit board manufacturing they are also utilized as an etch resist for the conductive pattern design after initial copper electroplating.
<figtable id="tab:Precious Metal Electrolytes for Decorative Applications">
|-
|RUTHENIUMBAD
|stronglyacidicstrongly acidic|900grey/black|99.0% Ru|Crack free thick ruthenium depositsVery hard and luster retaining Ruthenium coating
|-
|PLATINBAD 5|stronglyacidicstrongly acidic|240 - 260white|99.9% Pt|High temperature switching devicesJewelry, watches, etc.
|-
|DODUPAL 3
|7.0 - 87.06|220 Pd - 250color|99.995% Pd|Thin palladium layers Pd/Zn coating as Ni-free diffusion barrier|-|DODUPAL 5|7.0 - 8.0|220 - 250|99.9% Pd|Connectors and contact parts
|-
|DODUPAL 10
|8.0 - 8.5
|350 white|80%Pd|Pd/Zn alloy for jewelry|- 400|80DODUPAL 12|7.0 - 8.0|white|95% Pd|Pd/Ni Zn alloy for connectors and contact partsdecorations
|-
|colspan="5" |'''Silver electrolytes'''
|-
|ARGOL 2000
|approx11. 5 - 12.05|bright white|99.9%Ag|-|ARGOL 400||160 - 180|Jewelry, watches, decoration
</figtable>
